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Journal ArticleDOI

Fabrication and analysis of radiofrequency MEMS series capacitive single-pole double-throw switch

TLDR
In this paper, a single-pole double-throw (SPDT) switch based on series capacitive configuration is proposed, and the critical process parameters are analyzed to improve the fabrication process.
Abstract
A compact radiofrequency (RF) MEMS single-pole double-throw (SPDT) switch based on series capacitive configuration is proposed. The critical process parameters are analyzed to improve the fabrication process. A technique of cold–hot thermal shock for lift-off method is explored. The residual stress in the structure is quantified by lancet test structures that come out to be 51 MPa. Effect of residual stress on actuation voltage is explored, which changes its value from 24 to 22 V. Resonance frequency and switching speed of the switch are 11 kHz and 44  μs, respectively, measured using laser Doppler vibrometer. Measured bandwidth of the SPDT switch is 20 GHz (5 to 25 GHz), which is verified with finite element method simulations in high frequency structure simulator© and an equivalent LCR circuit in advanced design system©. Insertion loss of the switch lies in −0.1 to −0.5  dB with isolation better than −20  dB for the above-mentioned bandwidth.

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Citations
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Journal ArticleDOI

Improved Design of Ohmic RF MEMS Switch for Reduced Fabrication Steps

TL;DR: In this article, a single pole single throw (SPST) switch is developed without using any additional step, and the measured switching time of the switch is $1.8~\mu \text{s}$.
Journal ArticleDOI

Compact high isolation and improved bandwidth hybrid RF MEMS SPDT switch for 5G applications

TL;DR: In this article, a hybrid technique is used for the designing of a compact, high isolation and the enhanced bandwidth SPDT RF MEMS switch for 5G applications, which offers greater than 40dB isolation over a wide frequency range (>40dB over 22.10 GHz bandwidth) with less than 0.30dB insertion loss over the entire band.
Journal ArticleDOI

Improved isolation RF MEMS switch with post release ashing

TL;DR: In this paper, a mixed release process of wet and dry is presented to release the stiction free suspended microstructures, which is removed by plasma cleaning, which improves the isolation of the device under test to 22 dB from 15 dB after plasma exposure.
Journal ArticleDOI

Effect of Parasitic Capacitance on RF MEMS Switch OFF/ON Ratio

TL;DR: In this article, the authors extracted the RF MEMS capacitive switch LCR parameters considering parasitic capacitance to explain the mismatch of measured results, which is a function of switch geometry and directly proportional to dielectric constant of the substrate material.
Journal ArticleDOI

Low temperature epoxy bonding for RF MEMS capacitive switch

TL;DR: In this paper, inverted silicon cavity is used for capping the MEMS devices and the electrical and mechanical characteristics of the RF MEMS switch are analyzed using finite element method simulations.
References
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Book

RF MEMS: Theory, Design, and Technology

TL;DR: In this paper, the basics of RF MEMS and how to design practical devices and circuits are discussed, as well as expert tips for designers and a range of real-world applications.
Journal ArticleDOI

RF MEMS switches and switch circuits

TL;DR: In this paper, the authors concentrate on electrostatic switches at 0.1-100 GHz with high reliability (100 million to 10 billion cycles) and wafer-scale manufacturing techniques.
Journal ArticleDOI

Stiction in surface micromachining

TL;DR: In this article, four major adhesion mechanisms have been analyzed: capillary forces, hydrogen bridging, electrostatic forces and van der Waals forces, and they have been successfully reduced.
Journal ArticleDOI

Mechanics of adhesion in MEMS - a review

TL;DR: A review of the mechanics of microscale adhesion in microelectromechanical systems (MEMS) is presented in this article, where dimensionless numbers such as Tabor number, adhesion parameter and peel number for microscale elastic adhesion contact are discussed in detail.
Journal ArticleDOI

Multi-layer SU-8 lift-off technology for microfluidic devices

TL;DR: In this article, a multilayer SU-8 lift-off technology is proposed for low-cost rapid prototyping of microfluidic devices, which enables the creation of through holes.
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