Journal ArticleDOI
Considerations of anodic bonding for capacitive type silicon/glass sensor fabrication
TLDR
In this article, the suitability of various glass types for different applications, and in particular for absolute capacitive pressure sensors, is discussed and solutions suggested for improving the properties of these properties.Abstract:
The author discusses the suitability of various glass types for different applications, and in particular for absolute capacitive pressure sensors. Some process induced effects which can affect the yield and performance of such devices are investigated and solutions suggested for improving these properties. Effects considered include electrolysis and process induced compositional changes. These can manifest themselves as bowed or warped assemblies, degraded bonds and metallized layers, and poor sensitivity and temperature stability of the resulting devices. Some solutions to these problems are discussed.read more
Citations
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Journal ArticleDOI
Selection of glass, anodic bonding conditions and material compatibility for silicon-glass capacitive sensors
T. Rogers,Jan Kowal +1 more
TL;DR: In this article, the authors examined the process of anodic bonding with regard to the fabrication of silicon-glass capacitive sensors and showed the flatness control of these glasses when bonded to silicon at different temperatures.
Journal ArticleDOI
Die-attachment solutions for SiC power devices
TL;DR: This work focuses on die attach technologies: solder bonding by means of gold–germanium alloys, adhesive bonding with the use of organic and inorganic conductive compositions, as well as die bonding withthe use of low temperature sintering with silver nanoparticles.
Journal ArticleDOI
Contributed Review: The feasibility of a fully miniaturized magneto-optical trap for portable ultracold quantum technology
TL;DR: In this paper, the magneto-optical trap was used to construct a permanently sealed micro-litre system capable of maintaining 10−10mbar for more than 1000 days of operation with passive pumping alone.
Journal ArticleDOI
The feasibility of a fully miniaturized magneto-optical trap for portable ultracold quantum technology
TL;DR: The feasibility of incorporating the vacuum system, atom source and optical geometry into a permanently sealed micro-litre system capable of maintaining 10(-10) mbar for more than 1000 days of operation with passive pumping alone is explored.
Journal ArticleDOI
Reliability of MEMS packaging: vacuum maintenance and packaging induced stress
TL;DR: In this article, a vibratory gyroscope sensor is fabricated with anodically bonded wafer level vacuum packaging followed by diebonding and wire-bonding processes, and the epoxy-molding compound (EMC) is applied to encapsulate the sensor.
References
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Journal ArticleDOI
Field Assisted Glass‐Metal Sealing
TL;DR: In this paper, a new process is described which permits the sealing of metals to glass and other insulators at temperatures well below the softening point of the glass, by applying a dc voltage in excess of a few hundred volts between the glass and the metal in such a way that the former is at a negative potential with respect to the latter.
Journal ArticleDOI
Capacitive silicon accelerometer with highly symmetrical design
TL;DR: In this paper, the design and performance of a capacitive micromechanical accelerometer, as well as an electronic circuit for the conditioning of the output signal are described, which consists of a differential capacitance which is formed by a seismic silicon mass and two counter electrodes situated on anodically bonded glass plates.
Journal ArticleDOI
Ion Depletion of Glass at a Blocking Anode: II, Properties of Ion‐Depleted Glasses
TL;DR: In this paper, the authors extended the investigation of ion depletion to several types of ion-conducting glass and presented new data for the physical and chemical properties of depleted surfaces, showing that the removal of ions from the vicinity of the anode creates a microporous region that densifies at a rate determined by glass composition, temperature and voltage.
Journal ArticleDOI
Electrode Phenomena during Anodic Bonding of Silicon to Sodium Borosilicate Glass
TL;DR: In this article, the anodic reaction, oxidation of the silicon, requires very high electric fields in anodic depletion layer and is the limiting electrode reaction, and the ohmic drop in the glass determines the rate of establishment of high interfacial fields.
Proceedings ArticleDOI
Anodic bonding for integrated capacitive sensors
TL;DR: Anodic bonding of silicon to Pyrex glass was studied from the viewpoint of its application to integrated capacitive sensors in this paper, where equipment that allowed substrate bonding in atmosphere and in vacuum is described.
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Selection of glass, anodic bonding conditions and material compatibility for silicon-glass capacitive sensors
T. Rogers,Jan Kowal +1 more