Journal ArticleDOI
Die-attachment solutions for SiC power devices
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TLDR
This work focuses on die attach technologies: solder bonding by means of gold–germanium alloys, adhesive bonding with the use of organic and inorganic conductive compositions, as well as die bonding withthe use of low temperature sintering with silver nanoparticles.About:
This article is published in Microelectronics Reliability.The article was published on 2009-06-01. It has received 143 citations till now. The article focuses on the topics: Anodic bonding & Adhesive bonding.read more
Citations
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Journal ArticleDOI
Die Attach Materials for High Temperature Applications: A Review
TL;DR: This literature work seeks to review the numerous research attempts thus far for high temperature die attach materials on wide band gap materials of silicon carbide, gallium nitride and diamond, document their successes, concerns and application possibilities, all of which are essential for highTemperature reliability.
Journal ArticleDOI
Mechanical properties of nano-silver joints as die attach materials
TL;DR: In this paper, the development of silver (Ag) as a die attach bonding material in the microelectronic packaging industry from its early days as micron-scale silver flakes to the recent nanoscale Ag paste and other derivatives is discussed.
Journal ArticleDOI
State of the art of high temperature power electronics
Cyril Buttay,Dominique Planson,Bruno Allard,Dominique Bergogne,Pascal Bevilacqua,Charles Joubert,Mihai Lazar,Christian Martin,Hervé Morel,Dominique Tournier,Christophe Raynaud +10 more
TL;DR: In this article, a power converter operating at temperatures above 200 °C has been demonstrated, but work is still ongoing to design and build a power system able to operate in harsh environment (high temperature and deep thermal cycling).
Journal ArticleDOI
A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices
TL;DR: In this paper, the authors present a review of high-temperature power devices with a focus on the die attach materials operating at temperatures higher than 623 K (350 K).
Journal ArticleDOI
Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications
TL;DR: The theoretical background and transition of applications from micro to nanoparticle (NP) pastes based on joining using silver filler materials and nanojoining mechanisms are elucidated, and the future outlook for joining applications with silver nanomaterials is explored.
References
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Journal ArticleDOI
Power Conversion With SiC Devices at Extremely High Ambient Temperatures
Tsuyoshi Funaki,Juan Carlos Balda,J. Junghans,Avinash Srikrishnan Kashyap,Homer Alan Mantooth,Fred Barlow,Tsunenobu Kimoto,Takashi Hikihara +7 more
TL;DR: In this article, the capability of SiC power semiconductor devices, in particular JFET and Schottky barrier diodes (SBDs), for application in high-temperature power electronics was evaluated.
Journal ArticleDOI
High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment
TL;DR: In this article, a low-temperature sintering of nanoscale silver paste was used to achieve high temperature operation of SiC power semiconductor devices by using stencil-printed layers of the nano-scale silver paste on Au or Ag metallized direct bonded copper (DBC) substrates for die-attachment.
Journal ArticleDOI
Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices
TL;DR: In this paper, screen/stencil-printable nanosilver pastes were processed and characterized for die-attaching SiC devices, which could enable packaging of wide bandgap semiconductors devices such as SiC or GaN for high-temperature operation.
Proceedings ArticleDOI
Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules
TL;DR: In this paper, the authors present a selection of materials that are potentially suitable for use in high temperature package assembly, including die attach, substrate, interconnections, encapsulation, case, heat spreader and heat sink.
Journal ArticleDOI
Reliability of high temperature solder alternatives
TL;DR: This paper presents constitutive and reliability information on one of the widely used high lead solder materials as a baseline, and discusses potential alternative technologies for high temperature solders with the goal of identifying a cost-effective lead-free solder that can be used at temperatures greater than 200 °C.