Journal ArticleDOI
Copper on sapphire: Stability of thin films at 0.7 Tm
C.M. Kennefick,Rishi Raj +1 more
TLDR
In this paper, it was shown that thin films of copper deposited on the (1120) plane of sapphire disintegrated into clusters when annealed at 650°C under nonoxidizing conditions.About:
This article is published in Acta Metallurgica.The article was published on 1989-11-01. It has received 75 citations till now. The article focuses on the topics: Texture (crystalline) & Grain boundary.read more
Citations
More filters
Journal ArticleDOI
Capillary instabilities in thin films
E. Jiran,Carl V. Thompson +1 more
TL;DR: In this article, the authors have studied initially continuous and patterned films of gold on fused silica substrates and two in situ techniques were used to monitor agglomeration: heating and video recording in a transmission electron microscope, and measurement of the intensity of laser light transmitted through a sample heated in a furnace.
Journal ArticleDOI
Current limit diagrams for dendrite formation in solid-state electrolytes for Li-ion batteries
Rishi Raj,Jeff Wolfenstine +1 more
TL;DR: In this article, the authors build upon the concept that nucleation of lithium dendrites at the lithium anode-solid state electrolyte interface is instigated by the higher resistance of grain boundaries that raises the local electro-chemical potential of lithium, near the lithium-electrode.
Journal ArticleDOI
Periodic mass shedding of a retracting solid film step
TL;DR: In this article, the authors studied the two-dimensional retraction of a semi-infinite, uniform film on a substrate, assuming that the film evolves by capillarity-driven surface diffusion.
Journal ArticleDOI
Structure Evolution in Hydrothermally Processed (<100°C) BaTiO3 Films
TL;DR: In this paper, thin films of cubic BaTiO3 were processed hydrothermally at 40°-80°C by reacting thin layers of titanium organo metallic liquid precursors in aqueous solutions of either Ba(OH)2 or a mixture of NaOH and BaCl2.
Journal ArticleDOI
Microstructure evolution during dewetting in thin Au films
Claudia M. Müller,Ralph Spolenak +1 more
TL;DR: In this article, electron backscatter diffraction (EBSD) was used to study branched void growth in thin Au films and the holes were found to protrude into the film predominantly at high angle grain boundaries, which can be explained by surface energy minimization of the grains at the void boundaries.
References
More filters
Journal ArticleDOI
Quantitative observation of misfit dislocation arrays in low and high angle twist grain boundaries
T. Schober,R. W. Balluffi +1 more
TL;DR: In this article, the fine structure of (001) twist boundaries in gold was systematically studied by transmission electron microscopy, and about 200 such boundaries were prepared under controlled conditions by welding single crystal films together face-to-face at various twist angles.
Journal ArticleDOI
Finger-like crack growth in solids and liquids
R. J. Fields,Michael F. Ashby +1 more
TL;DR: In this paper, it was shown that grain-boundary voids resemble voids in liquids, or in very viscous adhesives, all of which show a transition from a stable smooth periphery to an unstable, finger-like one as the void growth rate increases.
Journal ArticleDOI
Solid-solid interfacial energy determinations in metal-ceramic systems
R. M. Pilliar,J. Nutting +1 more
TL;DR: In this paper, small metal particles have been formed on α-Al2O3 films and equilibrated to give the minimum surface energy shapes, which can be determined by transmission electron microscopy.
Journal ArticleDOI
On the flow stress of metals at low temperatures
TL;DR: In this article, a new interpretation of the temperature dependence of flow stress τ(T) was proposed, in which τ (T)=τ(0)-τT, and it accords with the view that the deformation rate is controlled by dislocation intersections.