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Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates
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The article was published on 2011-01-28 and is currently open access. It has received 11 citations till now. The article focuses on the topics: Power integrity & Signal integrity.read more
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Journal ArticleDOI
Signal integrity: Efficient, physics-based via modeling: Integration of striplines
Renato Rimolo-Donadio,G. Selli,F. de Paulis,Xiaoxiong Gu,Young H. Kwark,James L. Drewniak,H-D Bruens,Christian Schuster +7 more
TL;DR: In this article, the authors present an approach to integrate striplines into the physics-based via model, which can be located at any layer of the stackup and they may constitute both single and multiconductor transmission lines.
DissertationDOI
Extension of the contour integral method for stochastic modeling of waveguiding structures
Journal ArticleDOI
Signal integrity: Efficient, physics-based via modeling: Principles and methods
TL;DR: In this article, the high-frequency behavior of thruhole vias enclosed by solid reference planes in packages and printed circuit boards is discussed and some efficient modeling alternatives for signal and power integrity applications.
Proceedings ArticleDOI
Efficient Construction of Interconnect Passive Macromodels Through Segmented Analysis
TL;DR: It is shown that it can be more efficient to obtain and enforce passivity on partial macromodels, and then construct the full Macromodel through the concatenation of the respective state-space representation matrices.
Proceedings ArticleDOI
Evaluation of a Segmented Approach to Model PCB-Based Links of a PCIe Bus
Javier Aparicio-Morales,Gabriel Gamboa-Gonzalez,Rolando Moraga-Mora,Juan Carlos Rojas-Fernandez,Renato Rimolo-Donadio +4 more
TL;DR: It will be shown that, for the studied topology, transmission can be estimated through the segmented approach with good accuracy below 20 GHz, however, differences are observed at higher frequencies.