End-to-End Analysis of Integration for Thermocouple-Based Sensors Into 3-D ICs
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This paper proposes a low-overhead design methodology by linking the sensor placement task with the existing thermal TSV planning phase for 3-D ICs, and demonstrates that it can achieve high accuracy (1 °C error) in temperature tracking while still maintaining the effectiveness of the thermal TSVs in heat management.Abstract:
Solutions to the integration challenges of a new thermal sensor technology into 3-D integrated circuits (ICs) will be discussed in this paper Our proposed architecture uses bimetallic thin-film thermocouples, which are thermally linked to points of measurement throughout the 3-D stack with dedicated vias These vias will be similar to thermal through-silicon vias (TSVs) in structure, yet different in functionality We propose a low-overhead design methodology by linking the sensor placement task with the existing thermal TSV planning phase for 3-D ICs A fraction of thermal TSV resources is decoupled from their original use and repurposed for the temperature sensing infrastructure Tradeoffs concerning the reduction of the thermal TSV resources are investigated Furthermore, we present an end-to-end system, including the physical realization of the sensor network as well as its analog interface circuitry with the sensor data sampling unit We demonstrate the operation and correctness of this interface with transistor-level simulations Next, through thermal modeling and simulation using a state-of-the-art tool (FloTHERM), we demonstrate that we can achieve high accuracy (1 °C error) in temperature tracking while still maintaining the effectiveness of the thermal TSVs in heat management (conforming to a peak temperature constraint of 95 °C)read more
Citations
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Journal ArticleDOI
Microsystems using three-dimensional integration and TSV technologies: Fundamentals and applications
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Dissertation
Modèles compacts électro-thermiques du premier ordre et considération de bruit pour les circuits 3D
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Temperature-Aware DRAM Cache Management—Relaxing Thermal Constraints in 3-D Systems
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A High-Efficiency Design Method of TSV Array for Thermal Management of 3-D Integrated System
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A High-Efficiency Design Method of TSV Array for Thermal Management of 3-D Integrated System
TL;DR: In this paper , a high-efficient design method of through silicon via (TSV) array for thermal management of 3D integrated system is developed based on the equivalent thermal conductivity (ETC) model and the particle swarm optimization algorithm.
References
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Journal ArticleDOI
The Development of a Stable Citrate Electrolyte for the Electrodeposition of Copper‐Nickel Alloys
TL;DR: In this paper, the stability of citrate electrolytes for the electrodeposition of copper-nickel alloys and multilayers has been investigated and it was found that electrolytes operating at pH 4 are unstable due to the formation of an insoluble citrate complex.
Journal ArticleDOI
Thermopower in Thin‐Film Copper—Constantan Couples
TL;DR: In this article, the thickness dependence of the thermal emf of thin-film copper thermocouples at room temperature and above was investigated and it was shown that when the thickness of both elements comprising the thermocouple is greater than ∼1200 A, the thermal response time of the thermouples as measured with a pulsed laser beam heating source is less than 10−6 sec.
Proceedings ArticleDOI
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Jason Cong,Guojie Luo,Yiyu Shi +2 more
TL;DR: This is the first thermal-aware 3D placement tool that directly takes into consideration the thermal and area impact of though-silicon-vias (TSVs), and suggests that considering thermal effects of TSVs is necessary and effective during the placement stage.
Journal ArticleDOI
Temperature-modulated graphene oxide resistive humidity sensor for indoor air quality monitoring
A. De Luca,Sumita Santra,Ruma Ghosh,S. Z. Ali,Julian W. Gardner,Prasanta Kumar Guha,Florin Udrea +6 more
TL;DR: The effectiveness of integrating GO on a micro-hotplate CMOS-compatible platform enabling temperature modulation schemes to be easily applied in order to achieve compact, low power, low cost humidity IAQ monitoring is demonstrated.
Proceedings ArticleDOI
Thermal via allocation for 3D ICs considering temporally and spatially variant thermal power
TL;DR: This paper develops an accurate and efficient thermal-via allocation considering the temporally and spatially variant thermal-power, and is solved by a sequential quadratic programming algorithm with use of sensitivities from the macromodel.