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Journal ArticleDOI

Formation of an amorphous Rh‐Si alloy by interfacial reaction between amorphous Si and crystalline Rh thin films

S. R. Herd, +2 more
- 01 Apr 1983 - 
- Vol. 42, Iss: 7, pp 597-599
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TLDR
In this paper, the formation of an amorphous rh-Si alloy film upon thermal annealing at 300 °C was observed, followed by the formation RhSi or a mixture of RhSi and Rh5Si3 around 400
Abstract
Interfacial reaction in bilayers of amorphous Si and crystalline Rh thin films has been studied by transmission electron diffraction and microscopy. In a bilayer of ∼190‐A amorphous Si and ∼60‐A polycrystalline Rh films, we have observed the formation of an amorphous Rh‐Si alloy film upon thermal annealing at 300 °C. The amorphous alloy film crystallizes into the RhSi phase at 400 °C. On the other hand, no amorphous alloy formation was observed upon annealing a bilayer of ∼150‐A amorphous Si and ∼100‐A polycrystalline Rh films; instead, they react at 300 °C to form Rh2Si, followed by the formation of RhSi or a mixture of RhSi and Rh5Si3 around 400 °C.

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Tin–lead (SnPb) solder reaction in flip chip technology

TL;DR: In this paper, a review of the reactions between SnPb and one of the four metals, Cu, Ni, Au, and Pd have been reviewed on the basis of the available data of morphology, thermodynamics, and kinetics.
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Amorphization by ball milling. A review

TL;DR: In this paper, a new method for the preparation of amorphous alloys is the mechanical alloying process, and criteria for amorphization and a method to determine the glass forming range of TM-TM systems are given.
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The synthesis of amorphous NiTi alloy powders by mechanical alloying

TL;DR: In this article, high-energy ball milling was used to alloy polycrystalline powders of Ni and Ti in an inert atmosphere at T < 240 K. The alloyed NixTi1−x powders were characterized by scanning electron microscopy, X-ray diffraction, and differential scanning calorimetry.
Journal ArticleDOI

Amorphous Ti-Si alloy formed by interdiffusion of amorphous Si and crystalline Ti multilayers

TL;DR: In this paper, a 30-s thermal annealing of sputtered Ti-Si multilayers was studied by cross-section and through-foil transmission electron microscopy, glancingangle Rutherford backscattering, and x-ray diffraction.
References
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Journal ArticleDOI

Metal contact induced crystallization in films of amorphous silicon and germanium

TL;DR: In this paper, the crystallization and compound formation temperature of vacuum deposited amorphous Si (and Ge) while in contact with various crystalline metals as a thin film sandwich are investigated by electron microscopy and electron diffraction.
Journal ArticleDOI

Review of binary alloy formation by thin film interactions

TL;DR: In this article, the formation and properties of binary compounds made by thin-film interactions at temperatures well below the melting point of the various components were studied and it was suggested that the processes occurring at the interfaces control the phase formed.
Journal ArticleDOI

Thin film interaction between titanium and polycrystalline silicon

TL;DR: In this paper, the authors investigated the interaction between polycrystalline and monocrystalline silicon in the temperature range 400-1100 °C using sheet resistance, x-ray diffraction, and stress measurements.
Journal ArticleDOI

1 &#181;m MOSFET VLSI technology: Part VII&#8212;Metal silicide interconnection technology&#8212;A future perspective

TL;DR: An alternative approach which combines a doped polycrystalline silicon layer with a high-conductivity metal silicide such as WSi2(polycide) is described, which is demonstrated to provide at least an order of magnitude improvement in interconnection resistance relative to polycrystaline silicon.
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