Grinding of silicon wafers: A review from historical perspectives
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TLDR
In this paper, historical perspectives on grinding of silicon wafers, impacts of wafer size progression on applications of grinding in silicon wafer manufacturing, and interrelationships between grinding and two other silicon machining processes (slicing and polishing) are discussed.Abstract:
The majority of semiconductor devices are built on silicon wafers. Manufacturing of high-quality silicon wafers involves several machining processes including grinding. This review paper discusses historical perspectives on grinding of silicon wafers, impacts of wafer size progression on applications of grinding in silicon wafer manufacturing, and interrelationships between grinding and two other silicon machining processes (slicing and polishing). It is intended to help readers to gain a more comprehensive view on grinding of silicon wafers, and to be instrumental for research and development in grinding of wafers made from other materials (such as gallium arsenide, germanium, lithium niobate, sapphire, and silicon carbide).read more
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Nivasan Yogeswaran,Wenting Dang,William Taube Navaraj,Dhayalan Shakthivel,Saleem Khan,Emre O. Polat,Shoubhik Gupta,Hadi Heidari,Mohsen Kaboli,Leandro Lorenzelli,Gordon Cheng,Ravinder Dahiya +11 more
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References
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Mirror Surface Grinding of Silicon Wafers with Electrolytic In-Process Dressing
Hitoshi Ohmori,Takeo Nakagawa +1 more
TL;DR: In this paper, the authors have studied finish grinding techniques, and succeeded in developing a new grinding technique that realises mirror quality surfaces, which uses Electrolytic In-process Dressing and micro-grain cast iron fiber bonded wheel's.
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TL;DR: This paper presents a meta-analyses of the physical properties of Si and GaAs at 300 K and some of the properties of the Error Function found in the literature on basic Kinetic Theory of Gases.