Journal ArticleDOI
Heat Transfer Characteristics of High Heat Generating Integrated Circuit Chips Cooled Using Liquid Cold Plate—A Combined Numerical and Experimental Study
TLDR
In this article, the experimental and numerical investigations of seven integrated circuit (IC) chips cooled using the water flowing inside the cold plate at different flowrates were carried out using the commercial software ansys fluent (R-16).Abstract:
This paper deals with the experimental and numerical investigations of seven integrated circuit (IC) chips cooled using the water flowing inside the cold plate at different flowrates. The study includes the supply of three different heat input cases under four different flowrates (0.063 kg/s, 0.125 kg/s, 0.25 kg/s, and 0.5 kg/s) to cool the high heat-generating IC chips mounted on the SMPS board at various positions. The optimal configuration (71-11-74-76-65-24-15) for the arrangement of the 7 IC chips is considered for the analysis. The numerical simulations are carried out using the commercial software ansys fluent (R-16) to support the experiments. Both the results (IC chips temperature) agree with each other in the error band of 8–14%. The smallest chip U6 attains the maximum temperature, as its heat attenuation rate is very high. The water flowing inside the cold plate absorbs the heat from the IC chips; by increasing the flowrate (Reynolds number increases), there is an increase in the convective heat transfer coefficient of the chips (Nusselt number increases) and ultimately cools these faster. A correlation is proposed for the Nusselt number of the chips with the Reynolds number of the flow. The results suggest that the liquid cold plate plays a vital role in the cooling of the IC chips and leads to better thermal management.read more
Citations
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Journal ArticleDOI
Effect of thermal conductivity of substrate board for temperature control of electronic components: A numerical study
TL;DR: In this paper, the numerical investigation of the substrate board characteristics using different materials (FR4, silicon cladding and copper cladding) on which nine non-identical elec...
Book ChapterDOI
Technical Review on Battery Thermal Management System for Electric Vehicle Application
TL;DR: In this article , an overview of the research that has been conducted on thermal management of lithium-ion batteries utilizing heat pipes, liquid cooling, and phase change material cooling, which can be detailed classified as an active and passive thermal management system.
Book ChapterDOI
Thermal Design and Numerical Investigation of Cold Plate for Active Water Cooling for High-Energy Density Lithium-Ion Battery Module
TL;DR: In this paper , a comparative analysis of the temperature and velocity distributions inside cold plates mounted on a lithium-ion battery identical mimic battery module using the NMC 18,650 cell and a lumped numerical method for the conjugate heat transfer battery model is presented.
Fundamental performance limits of heatsinks
TL;DR: In this paper, the authors considered size requirements for the constraints of fixed air volume flow rate and pressure drop, fixed fan/blower power, and fixed thermal conductance, and provided simple power-law prediction of performance.
References
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Journal ArticleDOI
The Design of Cold Plates for the Thermal Management of Electronic Equipment
TL;DR: In this paper, the authors deal with the fluid flow and heat transfer in cold plates in which both the fluids flow and the heat transfer experience periodic variations in the streamwise direction and devise a methodology for dealing with problems that are highly complex and also computationally demanding.
Journal ArticleDOI
Fundamental Performance Limits of Heatsinks
TL;DR: In this paper, the authors considered size requirements for the constraints of fixed air volume flow rate and pressure drop, fixed fan/blower power, and fixed thermal conductance, and provided simple power-law prediction of performance.
Proceedings ArticleDOI
Test results from the comparison of three liquid cooling methods for high-power processors
Guy R. Wagner,Joseph R. Schaadt,Justin Dixon,Gary Chan,William Maltz,Kamal Mostafavi,David Copeland +6 more
TL;DR: In this article, the authors compared three different liquid cooling technologies to determine which of the three methods is able to cool the highest power density processor chips, and concluded that the liquid cooling method was the best.
Journal ArticleDOI
Optimal Distribution of Discrete Heat Sources Under Mixed Convection—A Heuristic Approach
TL;DR: In this article, the authors conducted steady state experiments in a low speed horizontal wind tunnel under mixed convection for five discrete heat sources (aluminum) of nonidentical sizes arranged at different positions on a substrate board (bakelite) to determine the optimal configuration.
Journal ArticleDOI
Experiment Driven Ann-GA Based Technique for Optimal Distribution of Discrete Heat Sources Under Mixed Convection
TL;DR: In this article, a completely experimental driven hybrid optimization strategy that combines Artificial Neural Network (ANN) with Genetic Algorithm (GA) is used to determine the optimal arrangement, such that, the maximum temperature excess is minimum among all the possible configurations.