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Influence of nanometre‐sized notch and water on the fracture behaviour of single crystal silicon microelements

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TLDR
In this article, the influence of a notch and a water environment on the quasi-static and fatigue fracture behavior was investigated in single crystal silicon microelements, and the results showed that the fracture strength decreased with an increase in the notch depth.
Abstract
The influence of a notch and a water environment on the quasi-static and fatigue fracture behaviour was investigated in single crystal silicon microelements The tests were conducted in smooth and notched microcantilever beam samples Smooth specimens were prepared by micromachining (photo-etching) of (110) silicon wafers For some specimens, a nanometre-sized notch was machined 100 pm away from the sample root by using a focused ion beam system A machining condition was optimized, and the V-shaped notch was successfully introduced The radius of curvature of the notch, measured by an atomic force microscope (AFM), decreased with an increase in notch depth, and ranged from about 20 to 100 nm Single-crystal Si microelements deformed elastically until final failure, which was of a brittle nature The maximum fracture strength of a smooth microcantilever specimen reached about 77 GPa, which was higher than that obtained in millimetre-sized single crystal Si samples However, the fracture strength decreased with an increase in notch depth, even though the notch depth was of the order of a nanometre, This means that a nanometre deep notch, which is often regarded as surface roughness in ordinary-sized mechanical components, caused a decrease in the fracture strength of Si microelements The fracture initiated at the notch, and then the {111} crack propagated in the direction normal to the sample surface Fatigue tests were also conducted in laboratory air and in pure water at a stress cycle frequency of 01 Hz and a stress ratio of 01 In laboratory air, no fatigue damage was observed even though the surface was nanoscopically examined by an AFM However, when the fatigue tests were conducted in pure water, the fatigue lives in water were decreased Crack formation on the {111} plane was promoted by a synergistic effect of the dynamic loading and the water environment Atomic force microscopy was capable of imaging the nanoscopic cracks, which caused failure in water

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Measuring fracture toughness of coatings using focused-ion-beam-machined microbeams

TL;DR: In this paper, a new technique for measuring the toughness of coatings is described, using a precracked micro-beam, which was produced using focused ion beam machining, then imaged and loaded to fracture using a nanoindenter.
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Mechanisms for Fatigue of Micron-Scale Silicon Structural Films†

TL;DR: In this paper, the authors review the literature on micron-scale thin silicon films and find that lower cyclic stresses result in larger number of cycles to failure in stress-lifetime data.
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Dynamic fatigue of silicon

TL;DR: In this article, an increase in high-cycle fatigue lifetime with a decrease in peak stress, the dependence of fatigue on the cyclic stress levels but not on the frequency of the cycle, and morphological changes in the surface silica during fatigue.
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Use of focused ion beam milling for investigating the mechanical properties of biological tissues: a study of human primary molars.

TL;DR: The usefulness of the specimen shaping ability of focused ion beam (FIB) milling in the micrometer scale and the high force resolution of the nanoindentation technique are demonstrated on human primary teeth.
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Process Temperature–Dependent Mechanical Properties of Polysilicon Measured Using a Novel Tensile Test Structure

TL;DR: In this article, a new test structure was developed to measure fracture strength, Young's modulus, and residual stress of polysilicon thin films, which can be used for tensile testing.
References
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Journal ArticleDOI

Fracture testing of silicon microelements in situ in a scanning electron microscope

TL;DR: Fracture testing of silicon cantilever beams (thicknesses 10-20 μm) was performed in situ in a scanning electron microscope by means of an equipment specially designed for this purpose as mentioned in this paper.
Journal ArticleDOI

Slow crack growth in single-crystal silicon.

TL;DR: The experiments demonstrate the possibility of rate-dependent failure of silicon devices and the applicability of linear elastic fracture mechanics to small-scale micromechanical devices and indicate that slow crack growth must therefore be considered when evaluating the reliability of thin-film silicon structures.
Journal ArticleDOI

In situ tensile strength measurement and Weibull analysis of thick film and thin film micromachined polysilicon structures

TL;DR: In this article, the Weibull theory was applied to a real micromechanical structure, i.e., standard test results were transformed into expected strength limits of a more complex structure.
Journal ArticleDOI

Fracture and fatigue behavior of single crystal silicon microelements and nanoscopic AFM damage evaluation

TL;DR: In this article, single-crystal silicon microelements fabricated by photoetching were subjected to simple bending and three-point bending with two-support roll length of 1.5 mm.
Journal ArticleDOI

Micromechanical fatigue testing

TL;DR: In this article, a single crystal silicon micromechanical device developed to evaluate fracture and fatigue of silicon based micro-computers is presented, where the structure is a cantilever beam, 300 microns long, with a large silicon plate and gold inertial mass at the free end.
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