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Investigation of surface morphology and ion activation of aluminium implanted 4H-SiC

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TLDR
In this paper, a graphite encapsulation layer was used for surface protection in the post-implantation activation annealing process of 4H-SiC power devices.
Abstract
Multiple-energy aluminium (Al+) implantation into 4H-SiC (0001) epilayer and activation anneal with a graphite encapsulation layer were investigated in this paper. Measurements showed that the implanted Al+ box doping profile was formed and a high ion activation ratio of 78% was achieved by 40 min annealing at 1600°C using a horizontal chemical vapor deposition (CVD) reactor. The step bunching effect associated with the high temperature post implantation activation annealing (PIA) process was dramatically suppressed by using the graphite encapsulation layer. And a flat and smooth surface with a small average surface roughness (RMS) value of around 1.16 nm was achieved for the implanted 4H-SiC after the PIA process. It was demonstrated that this surface protection technique is a quite effective process for 4H-SiC power devices fabrication.

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Journal ArticleDOI

Aluminum doping of 4H-SiC by irradiation of excimer laser in aluminum chloride solution

TL;DR: In this paper, aluminum doping into 4H-SiC is performed by irradiating excimer laser light to 4HSiC immersed in aluminum chloride solution and aluminum is introduced in SiC at the concentration of over 1? 1020 cm?3 near the surface.
Journal ArticleDOI

The synthesis of micro-sized silicon carbide whiskers and the application for heat transfer enhancement

TL;DR: In this article, a simple and cost-effective method for the production of micro-sized silicon carbide whiskers at high yield and the effect on heat transfer enhancement for the whisker laden fluids is presented.
Journal ArticleDOI

4H-SiC trench gate MOSFETs with field plate termination

TL;DR: In this article, field plate-terminated 4H-SiC trench gate MOSFETs with and without field plate (FP)-terminated field plate termination are demonstrated, and it is found that more than 60% of the devices protected with FP termination are able to block 850 V.
Journal ArticleDOI

Fabrication of a monolithic 4H-SiC junction barrier schottky diode with the capability of high current

TL;DR: In this article, a large-area monolithic 4H-SiC JBS diodes fabricated on a 10 µm epitaxial layer doped to 6×1015 cm−3 were reported.
Proceedings ArticleDOI

Enhanced aluminum doping profile in 4H-SiC by wet-chemical laser doping

TL;DR: In this paper, the enhancement of aluminum doping profile in semi-insulating 4H-SiC by using Eximer laser in AlCl3 aqueous solution is focused.
References
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Journal ArticleDOI

Deep levels created by low energy electron irradiation in 4H-SiC

TL;DR: In this paper, a low energy electron irradiation in the 80-250keV range was used to create only those intrinsic defects related to the initial displacements of carbon atoms in the silicon carbide lattice.
Journal ArticleDOI

Investigation of deep levels in n-type 4H-SiC epilayers irradiated with low-energy electrons

TL;DR: In this paper, deep levels in n-type 4H-SiC epilayers have been investigated by deep level transient spectroscopy (DLTS) and the Z1∕2 and EH6∕7 centers are dominant in as-grown samples.
Journal ArticleDOI

Surface roughening in ion implanted 4H-silicon carbide

TL;DR: In this article, the authors examined the causes and possible solutions to surface roughening of implanted and annealed 4H-SiC ion implant using atomic force microscopy.
Journal ArticleDOI

Electrical activation of high-concentration aluminum implanted in 4H-SiC

TL;DR: In this article, the dependences of the electrical properties on the implanted Al+ dose and on the annealing time were examined by Hall effect measurements, and the experimentally obtained free-hole concentrations agree well with the theoretically expected values.
Journal ArticleDOI

Detection and depth analyses of deep levels generated by ion implantation in n- and p-type 4H-SiC

TL;DR: In this paper, the authors investigated deep levels in the whole energy range of bandgap of 4H-SiC, which are generated by low-dose N+, P+, and Al+ implantation, by deep level transient spectroscopy (DLTS).
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