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Ion-assisted physical vapor deposition for enhanced film properties on nonflat surfaces

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TLDR
In this article, the authors synthesized Ta thin films on Si substrates placed along a wall of a 2 cm-deep and 1 cm-wide trench, using both a mostly neutral Ta flux by conventional dc magnetron sputtering (dcMS) and a mostly ionized Ta flux (HPPMS) by high-power pulsed magnetron stuttering.
Abstract
We have synthesized Ta thin films on Si substrates placed along a wall of a 2-cm-deep and 1-cm-wide trench, using both a mostly neutral Ta flux by conventional dc magnetron sputtering (dcMS) and a mostly ionized Ta flux by high-power pulsed magnetron sputtering (HPPMS). Structure of the grown films was evaluated by scanning electron microscopy, transmission electron microscopy, and atomic force microscopy. The Ta thin film grown by HPPMS has a smooth surface and a dense crystalline structure with grains oriented perpendicular to the substrate surface, whereas the film grown by dcMS exhibits a rough surface, pores between the grains, and an inclined columnar structure. The improved homogeneity achieved by HPPMS is a direct consequence of the high ion fraction of sputtered species.

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Citations
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Ionized physical vapor deposition (IPVD): A review of technology and applications

TL;DR: In this article, the development and application of magnetron sputtering systems for ionized physical vapor deposition (IPVD) is reviewed, and the application of a secondary discharge, inductively coupled plasma magnetron (ICP-MS), microwave amplified magnetron, and self-sustained sputtering (SSS) is discussed as well as the hollow cathode magnetron discharges.
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The Mn+1AXn phases: Materials science and thin-film processing

TL;DR: A critical review of the M(n + 1)AX(n) phases from a materials science perspective is given in this article, where the authors discuss the potential for low-temperature synthesis, which is essential for deposition of MAX phases onto technologically important substrates.
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High power pulsed magnetron sputtering: A review on scientific and engineering state of the art

TL;DR: High power pulsed magnetron sputtering (HPPMS) is an emerging technology that has gained substantial interest among academics and industrials alike as discussed by the authors, also known as HIPIMS (high power impulse...
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A structure zone diagram including plasma-based deposition and ion etching

TL;DR: In this article, an extended structure zone diagram is proposed that includes energetic deposition, characterized by a large flux of ions typical for deposition by filtered cathodic arcs and high power impulse magnetron sputtering.
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High power impulse magnetron sputtering discharge

TL;DR: The high power impulse magnetron sputtering (HiPIMS) discharge is a recent addition to plasma-based sputtering technology as mentioned in this paper, where high power is applied to the magnetron target in unipolar pulse.
References
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Journal ArticleDOI

A novel pulsed magnetron sputter technique utilizing very high target power densities

TL;DR: In this paper, the potential for high-aspect-ratio trench filling applications by high power pulsed magnetron sputtering is demonstrated by deposition in via-structures.
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Oblique evaporation and surface diffusion

TL;DR: In this article, the relation between surface diffusion and film structure is discussed in detail and found to be consistent with measurements published in the literature, including the influence of substrate temperature, rate and contamination with residual gasses.
Journal ArticleDOI

Phase control of cubic boron nitride thin films

TL;DR: In this paper, it was shown that for a given temperature, the controlling factor in the resulting thin film phase is the momentum transferred into the film per depositing boron atom.
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Microstructure modification of TiN by ion bombardment during reactive sputter deposition

TL;DR: In this article, cross-sectional transmission electron microscopy has been used to investigate the effects of low energy (400 eV or less) ion irradiation during the growth of reactively sputtered TiN at temperatures between 300 and 900 °C.
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Ionized sputter deposition using an extremely high plasma density pulsed magnetron discharge

TL;DR: In this paper, a novel high power density pulsed plasma discharge is presented, which consists of metallic and inert gas ions, determined from time resolved Langmuir probe measurements and in situ optical emission spectroscopy data.
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