Journal ArticleDOI
Laser micromachining of barium aluminium borosilicate glass with pulse durations between 20 fs and 3 ps
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TLDR
In this paper, an electron microscopic study showed that, below 100 fs, an extreme precision and a substantial decrease of the ablation threshold fluence with respect to pulse laser processing with pulses in the picosecond and nanosecond range could be achieved.About:
This article is published in Applied Surface Science.The article was published on 1998-05-01. It has received 69 citations till now. The article focuses on the topics: Pulse duration & Laser.read more
Citations
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Journal ArticleDOI
Frontiers in Ultrashort Pulse Generation: Pushing the Limits in Linear and Nonlinear Optics
TL;DR: The state of the art of ultrashort pulse generation is reviewed with a focus on direct laser oscillator schemes.
Journal ArticleDOI
Three-dimensional hole drilling of silica glass from the rear surface with femtosecond laser pulses.
Yan Li,Kazuyoshi Itoh,Wataru Watanabe,Kazuhiro Yamada,Daisuke Kuroda,Junji Nishii,Yongyuan Jiang +6 more
TL;DR: Three-dimensional channels can be micromachined inside transparent materials by use of this method, as it is demonstrated by drilling a square-wave-shaped hole inside silica glass.
Journal ArticleDOI
Laser shaping of photonic materials: deep-ultraviolet and ultrafast lasers
TL;DR: In this paper, the authors exploit two extremes in laser technology, ultrafast lasers and very short wavelength F2 lasers, to microsculpt surfaces and to control refractive index in transparent glasses.
Journal ArticleDOI
Femtosecond laser-induced-breakdown spectrometry for Ca2+ analysis of biological samples with high spatial resolution
Andreas Assion,Matthias Wollenhaupt,L. Haag,F. Mayorov,C. Sarpe-Tudoran,M. Winter,U. Kutschera,Thomas Baumert +7 more
TL;DR: In this article, an analytical method for element-specific in situ investigations of biological samples with high spatial resolution, using laser-induced breakdown spectroscopy (LIBS), was described.
Journal ArticleDOI
Crack-free direct-writing on glass using a low-power UV laser in the manufacture of a microfluidic chip
Ji-Yen Cheng,Meng-Hua Yen,Meng-Hua Yen,Cheng-Wey Wei,Cheng-Wey Wei,Yung-Chuan Chuang,Tai-Horng Young +6 more
TL;DR: In this paper, a laser-induced backside wet etching (LIBWE) was used for the fabrication of microfluidic microtrenches from glass chips using computer drawing software and then automatically translated into computer numerical control motion.
References
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Journal ArticleDOI
Laser‐induced breakdown by impact ionization in SiO2 with pulse widths from 7 ns to 150 fs
TL;DR: In this article, the results of laser-induced breakdown experiments in fused silica (SiO2) employing 150 fs −7 ns, 780 nm laser pulses are reported and the avalanche ionization mechanism is found to dominate over the entire pulse width range.
Journal ArticleDOI
Optical ablation by high-power short-pulse lasers
Brent C. Stuart,Michael D. Feit,S. Herman,Alexander M. Rubenchik,Bruce W. Shore,Michael D. Perry +5 more
TL;DR: In this paper, laser-induced damage threshold measurements were performed on homogeneous and multilayer dielectrics and gold-coated optics at 1053 and 526 nm for pulse durations τ ranging from 140 fs to 1 ns.
Journal ArticleDOI
Femtosecond UV excimer laser ablation
S. Kuper,Michael Stuke +1 more
TL;DR: In this paper, a model for ablation of polymethylmethacrylate (PMMA) with 300 fs uv excimer laser pulses at 248 nm is proposed, assuming a non-constant absorption coefficient αeff depending on the degree of incubation of the irradiated material and the intensity of the incoming excimer pulse.
Journal ArticleDOI
Nanosecond and femtosecond excimer laser ablation of fused silica
J. Ihlemann,B. Wolff,P. Simon +2 more
TL;DR: Ablation of fused silica using standard excimer lasers (20-30 ns pulse duration at 193, 248, and 308 nm) and a short pulse laser system (500 fs at 248 nm) is reported in this article.
Journal ArticleDOI
Laser ablation of dielectrics with pulse durations between 20 fs and 3 ps
TL;DR: In this article, a Ti sapphire laser system at a wavelength of 780 nm was used for ablation in a borosilicate glass with an extremely high glass transformation temperature (∼600°C).
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Femtosecond-pulse visible laser processing of transparent materials
Jörg Krüger,Wolfgang Kautek +1 more