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Method and device for measuring the thickness of thin films near a sample's edge and in a damascene-type structure

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TLDR
In this paper, a method for measuring a structure that contains overlying and underlying films in a region where the overlying film's thickness rapidly decreases until the underlying film is exposed (e.g., an edge-exclusion structure).
Abstract
A method for measuring a structure that contains overlying and underlying films in a region where the overlying film's thickness rapidly decreases until the underlying film is exposed (e.g., an edge-exclusion structure). The method includes the steps of: (1) exciting acoustic modes in a first portion of the region with at least one excitation laser beam; (2) detecting the acoustic modes with a probe laser beam that is either reflected or diffracted to generate a signal beam; (3) analyzing the signal beam to determine a property of the structure (e.g., the thickness of the overlying layer) in the first portion of the region; (4) translating the structure or the excitation and probe laser beams; and (5) repeating the exciting, detecting, and analyzing steps to determine a property of the structure in a second portion of the region.

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Citations
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References
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Journal ArticleDOI

Microfabricated structures for the in situ measurement of residual stress, Young’s modulus, and ultimate strain of thin films

TL;DR: In this paper, two microfabricated structures for the in situ measurement of mechanical properties of thin films, a suspended membrane, and an asymmetric released structure, were reported, and they yielded a residual tensile stress of 30 MPa and a Young's modulus of 3 GPa.
Journal ArticleDOI

Optical generation of tunable ultrasonic waves

TL;DR: In this paper, a method of optically exciting and monitoring coherent acoustic waves in transparent or light absorbing liquids and solids is described, and the acoustic frequency is easily and continuously tunable from ≊3 MHz to at least 30 GHz.
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Apparatus and a method for high numerical aperture microscopic examination of materials

TL;DR: In this article, a method for performing high resolution optical imaging in the near infrared of internal features of semiconductor wafers uses an optical device made from a material having a high index of refraction and held in very close proximity to the wafer.
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Thin-film thickness measurements with thermal waves

TL;DR: In this paper, a technique nouvelle de deflexion d'un faisceau laser induite par une onde thermique permettant de mesurer des epaisseurs de couches opaques ou transparentes de 500 a 25000 A.
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TL;DR: An optical stress pulse generation and detection system for nondestructively measuring physical properties of a sample, which uses a pump beam having short duration radiation pulses having an intensity and at least one wavelength selected to non-destructively generate a stress pulse in a sample and directs the nondestructive pump beam to a surface of the sample to generate the stress pulse as mentioned in this paper.