Journal ArticleDOI
Microstructural evolution and mechanical properties of Cu–Al alloys subjected to equal channel angular pressing
Shasha Qu,Xianghai An,Huajie Yang,Chongxiang Huang,Guanying Yang,Qing Zang,Z.G. Wang,Suxiang Wu,Zhefeng Zhang +8 more
TLDR
In this article, equal-channel angular pressing (ECAP) was used to investigate the influence of stacking fault energy (SFE) on the microstructural evolution during deformation and corresponding mechanical properties.About:
This article is published in Acta Materialia.The article was published on 2009-03-01. It has received 316 citations till now. The article focuses on the topics: Severe plastic deformation & Stacking-fault energy.read more
Citations
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Journal ArticleDOI
General relationship between strength and hardness
Peng Zhang,S.X. Li,Zhefeng Zhang +2 more
TL;DR: Zhang, P., Li, S. X., Zhang, Z. F., this paper proposed a method for Chinese Acad Sci, Inst Met Res, Shenyang National Lab Mat Sci, Shenya 110016, Peoples R China.
Journal ArticleDOI
Strengthening Mechanisms in a High-Strength Bulk Nanostructured Cu-Zn-Al Alloy Processed Via Cryomilling and Spark Plasma Sintering
TL;DR: In this paper, three-dimensional atom-probe tomography studies demonstrate that the distribution of Al is highly inhomogeneous in the sintered bulk samples, and Al-containing precipitates including Al(Cu,Zn)−O−N, Al-O-N and Al−N are distributed in the matrix.
Journal ArticleDOI
Structural evolutions of metallic materials processed by severe plastic deformation
TL;DR: In this paper, a comprehensive review on important micro-structural evolutions and major microstructural features induced by SPD processing in single-phase metallic materials with face-centered cubic structures, body-centered cylindrical structures, and hexagonal close-packed structures, as well as in multi-phase alloys is provided.
Journal ArticleDOI
Mechanical properties and deformation mechanisms of gradient nanostructured metals and alloys
TL;DR: In this article, a review of the state of the art in the field of gradient nanostructured metallic materials is presented, covering topics ranging from the fabrication and characterization of mechanical properties to underlying deformation mechanisms.
Journal ArticleDOI
The influence of strain rate on the microstructure transition of 304 stainless steel
TL;DR: In this paper, the deformation mechanisms of 304 stainless steel subjected to surface impacts over a wide range of strain rates (10−105 s−1) were investigated based on comprehensive analysis of X-ray diffraction and electron microscopy observations.
References
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Book
Recrystallization and Related Annealing Phenomena
F.J. Humphreys,M. Hatherly +1 more
TL;DR: In this paper, the authors discuss the extent to which we are able to formulate quantitative, physically-based models which can be applied to metal-forming processes, and the subjects treated in this book are all active research areas and form a major part of at least four regular international conference series.
Journal ArticleDOI
Bulk nanostructured materials from severe plastic deformation
TL;DR: In this article, the authors present methods of severe plastic deformation and formation of nanostructures, including Torsion straining under high pressure, ECA pressing, and multiple forging.
Journal ArticleDOI
Principles of equal-channel angular pressing as a processing tool for grain refinement
TL;DR: In this article, a review examines recent developments related to the use of ECAP for grain refinement including modifying conventional ECAP to increase the process efficiency and techniques for up-scaling the procedure and for the processing of hard-to-deform materials.
MonographDOI
Mechanical Behavior of Materials
TL;DR: A balanced mechanics-materials approach and coverage of the latest developments in biomaterials and electronic materials, the new edition of this popular text is the most thorough and modern book available for upper-level undergraduate courses on the mechanical behavior of materials as discussed by the authors.
Journal ArticleDOI
Ultrahigh strength and high electrical conductivity in copper
TL;DR: Pure copper samples with a high density of nanoscale growth twins are synthesized and show a tensile strength about 10 times higher than that of conventional coarse-grained copper, while retaining an electrical conductivity comparable to that of pure copper.