scispace - formally typeset
Journal ArticleDOI

Strengthening Mechanisms in a High-Strength Bulk Nanostructured Cu-Zn-Al Alloy Processed Via Cryomilling and Spark Plasma Sintering

TLDR
In this paper, three-dimensional atom-probe tomography studies demonstrate that the distribution of Al is highly inhomogeneous in the sintered bulk samples, and Al-containing precipitates including Al(Cu,Zn)−O−N, Al-O-N and Al−N are distributed in the matrix.
About
This article is published in Acta Materialia.The article was published on 2013-05-01. It has received 420 citations till now. The article focuses on the topics: Grain boundary strengthening & Strengthening mechanisms of materials.

read more

Citations
More filters
Journal ArticleDOI

A precipitation-hardened high-entropy alloy with outstanding tensile properties

TL;DR: In this paper, the authors demonstrate the possibility to precipitate a coherent reinforcing phase in a fcc-FeCoNiCr HEA matrix using minor additions of Ti and Al, and demonstrate that extraordinary balanced tensile properties at room temperature were achieved, which was due to a well combination of various hardening mechanisms, particularly precipitation hardening.
Journal ArticleDOI

Mechanical Behavior and Strengthening Mechanisms in Ultrafine Grain Precipitation-Strengthened Aluminum Alloy

TL;DR: In this article, the relationship between precipitation phenomena, grain size and mechanical behavior in a complex precipitation-strengthened alloy system, Al 7075 alloy, a commonly used aluminum alloy, was selected as a model system in the present study.
Journal ArticleDOI

Mechanical behavior of high-entropy alloys

TL;DR: In this article, the authors present a comprehensive, critical review of the mechanical behavior of high-entropy alloys and some closely related topics, including thermodynamics and kinetics.
Journal ArticleDOI

Structural evolutions of metallic materials processed by severe plastic deformation

TL;DR: In this paper, a comprehensive review on important micro-structural evolutions and major microstructural features induced by SPD processing in single-phase metallic materials with face-centered cubic structures, body-centered cylindrical structures, and hexagonal close-packed structures, as well as in multi-phase alloys is provided.
References
More filters
Journal ArticleDOI

X-ray line broadening from filed aluminium and wolfram

TL;DR: In this paper, the authors used a Geiger counter spectrometer to measure the changes in intensity distribution in the spectra of cold worked aluminium and wolfram and found that the line breadths may be attributed to simultaneous small particle size and strain broadening, the latter predominating at the higher Bragg angles.
Journal ArticleDOI

Bulk nanostructured materials from severe plastic deformation

TL;DR: In this article, the authors present methods of severe plastic deformation and formation of nanostructures, including Torsion straining under high pressure, ECA pressing, and multiple forging.
Journal ArticleDOI

Mechanical properties of nanocrystalline materials

TL;DR: The mechanical properties of nanocrystalline materials are reviewed in this paper, with emphasis on their constitutive response and on the fundamental physical mechanisms, including the deviation from the Hall-Petch slope and possible negative slope, the effect of porosity, the difference between tensile and compressive strength, the limited ductility, the tendency for shear localization, fatigue and creep responses.
Journal ArticleDOI

Principles of equal-channel angular pressing as a processing tool for grain refinement

TL;DR: In this article, a review examines recent developments related to the use of ECAP for grain refinement including modifying conventional ECAP to increase the process efficiency and techniques for up-scaling the procedure and for the processing of hard-to-deform materials.
Journal ArticleDOI

Ultrahigh strength and high electrical conductivity in copper

TL;DR: Pure copper samples with a high density of nanoscale growth twins are synthesized and show a tensile strength about 10 times higher than that of conventional coarse-grained copper, while retaining an electrical conductivity comparable to that of pure copper.
Related Papers (5)