Journal ArticleDOI
Modeling and analysis of 96.5Sn-3.5Ag lead-free solder joints of wafer level chip scale package on buildup microvia printed circuit board
John H. Lau,S.-W.R. Lee +1 more
TLDR
In this paper, the thermal-mechanical behavior of the lead-free solder bumped wafer level chip scale package (WLCSP) on microvia buildup printed circuit board (PCB) assemblies subjected to thermal cycling conditions are presented.Abstract:
In this study, time-temperature-dependent nonlinear analyses of lead-free solder bumped wafer level chip scale package (WLCSP) on microvia buildup printed circuit board (PCB) assemblies subjected to thermal cycling conditions are presented. The lead-free solder considered is 96.5Sn-3.5Ag. The 62Sn-2Ag-36Pb solder is also considered to establish a baseline. These two solder alloys are assumed to obey the Garofalo-Arrhenius steady-state creep constitutive law. The shear stress and shear creep strain hysteresis loops, shear stress history, shear creep strain history, and creep strain density range at the corner solder joint are presented for a better understanding of the thermal-mechanical behavior of the lead-free solder bumped WLCSP on microvia buildup PCB assemblies.read more
Citations
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Proceedings ArticleDOI
Aging and creep behavior of Sn3.9Ag0.6Cu solder alloy
TL;DR: Aging effects and creep behavior along with microstructure changes in eutectic PbSn and the lead-free solder alloy Sn39Ag06Cu were studied in this article.
Journal ArticleDOI
Fatigue Reliability Analysis of Sn–Ag–Cu Solder Joints Subject to Thermal Cycling
Fa Xing Che,John H. L. Pang +1 more
TL;DR: In this paper, thermal cycling tests and finite element analysis for a plastic ball grid array package with Sn-3.8Ag-0.7Cu lead-free solder joints have been performed.
Journal ArticleDOI
Experimental and finite element analysis of the shear speed effects on the Sn–Ag and Sn–Ag–Cu BGA solder joints
Jong-Woong Kim,Seung-Boo Jung +1 more
TL;DR: In this paper, the effect of ball shear speed on the shear forces of BGA solder joints was investigated using an elastic-viscoplastic constitutive model and a non-linear finite element analysis.
Proceedings ArticleDOI
Thermal fatigue reliability analysis for PBGA with Sn-3.8Ag-0.7Cu solder joints
Fa Xing Che,John H. L. Pang +1 more
TL;DR: In this paper, a two-parameter Weibull distribution model was used to determine the mean time to failure (MTTF) of PBGA components with Sn-3.8Ag-0.7Cu solder joints.
Journal ArticleDOI
Tensile creep and microstructural characterization of bulk Sn3.9Ag0.6Cu lead-free solder
Qiang Xiao,William D. Armstrong +1 more
TL;DR: In this article, the microstructural and creep behavior of bulk 63SnPb37 and the Pb-free solder alloy Sn3.9Ag0.6Cu are reported and compared.
References
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Journal ArticleDOI
Constitutive relations for tin-based-solder joints
R. Darveaux,Kingshuk Banerji +1 more
TL;DR: In this article, extensive data on 62Sn36Pb2Ag, 60Sn40Pb, 96.5Sn3.5Ag, 97.5Pb5Sn, and 95Pb6Sn solder assemblies were collected to properly account for the effects of grain size and intermetallic compound distribution.
Book
Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
John H. Lau,Yi-Hsin Pao +1 more
TL;DR: Reliability testing and data analysis failure analysis and root cause identification design for reliability solder joint reliability of BGA assemblies solder joints reliability of CSP assembly solder joints of flip chip assemblies.
Journal ArticleDOI
Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review
TL;DR: A review of the literature on the microstructure and mechanical properties of lead-free solders, including Sn-58Bi, Sn-52In, and Sn-3.5Ag, is presented in this paper.
Journal ArticleDOI
Lead (Pb)-free solders for electronic packaging
Sung K. Kang,Amit K. Sarkhel +1 more
TL;DR: In this paper, the suitability of Pb-free solders for electronic packaging from the viewpoint of process technology and reliability is evaluated using several studies, including wetting characteristics, tensile and shear strength, and creep and low-cycle fatigue properties of these alloys.
Related Papers (5)
Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
John H. Lau,Yi-Hsin Pao +1 more