Journal ArticleDOI
Solder joint fatigue models: review and applicability to chip scale packages
TLDR
A review of fourteen solder joint fatigue models is presented in this article with an emphasis on summarizing the features and applications of each fatigue model, and two fatigue model application scenarios are discussed.About:
This article is published in Microelectronics Reliability.The article was published on 2000-02-28. It has received 487 citations till now.read more
Citations
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Journal ArticleDOI
Study and Handling Methods of Power IGBT Module Failures in Power Electronic Converter Systems
TL;DR: An overview of the major failure mechanisms of IGBT modules and their handling methods in power converter systems improving reliability is presented in this article, where fault-tolerant strategies for improving the reliability of power electronic systems under field operation are explained and compared in terms of performance and cost.
Proceedings ArticleDOI
Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints
TL;DR: In this paper, the authors describe in detail the life prediction models for SnAgCu solder joints, which are based on published constitutive equations for this alloy and thermal cycle fatigue data on actual components.
Journal ArticleDOI
A Lifetime Estimation Technique for Voltage Source Inverters
Hui Huang,Philip Mawby +1 more
TL;DR: In this paper, the authors present a method to estimate the inverter lifetime so that we can predict a failure prior to it actually happening, which can be used as a converter design tool or online lifetime estimation tool.
Proceedings ArticleDOI
New physical model for lifetime estimation of power modules
TL;DR: A physical model for lifetime estimation of standard power modules is proposed based on Clech's algorithm for simulation of stress-strain solder response under cyclical thermal loading and on the solder deformation mechanism map used to define the dominant failure mechanism under observed stress-temperature conditions.
Proceedings ArticleDOI
Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy
TL;DR: In this paper, a life prediction model for solder joints for thermal cycle conditions and its extension to power and bend, cycle conditions is presented, which uses advance finite element modeling and analysis techniques such as constraint equations and substructuring and is based on mechanics of deformation.
References
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MonographDOI
Mechanical Behavior of Materials
TL;DR: A balanced mechanics-materials approach and coverage of the latest developments in biomaterials and electronic materials, the new edition of this popular text is the most thorough and modern book available for upper-level undergraduate courses on the mechanical behavior of materials as discussed by the authors.
Book
Fundamentals of metal fatigue analysis
TL;DR: In this paper, the authors present a comparison of methods for stress-life, strain-life and multiaxial fatigue in the context of Fracture Mechanics and Variable Amplitude Loading.
Book
Mechanical Behavior of Materials
TL;DR: In this article, a course focused on the experimental study of mechanical behavior of engineering materials is presented, where the theoretical background and techniques used for testing are extensively discussed in class, alongside the lab sessions.
Proceedings Article
Microelectronics reliability
TL;DR: In this article, the importance of the involvement of the design and manufacturing team in achieving reliability of microelectronic devices is highlighted. And a method of verifying reliability goals through calculation of failure rates based on life test parameters is described.
Book
Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
John H. Lau,Yi-Hsin Pao +1 more
TL;DR: Reliability testing and data analysis failure analysis and root cause identification design for reliability solder joint reliability of BGA assemblies solder joints reliability of CSP assembly solder joints of flip chip assemblies.