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Journal ArticleDOI

Reduced density of effective electrons in metal films

Johann Vancea, +1 more
- 18 Jun 1982 - 
- Vol. 92, Iss: 3, pp 219-225
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TLDR
In this article, the thickness-dependent conductivity of aluminium, gold and copper films was measured during evaporation by a process-controlled experiment and four parameters were evaluated by applying an extended Fuchs' theory.
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This article is published in Thin Solid Films.The article was published on 1982-06-18. It has received 32 citations till now. The article focuses on the topics: Evaporation & Aluminium.

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Citations
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Transparent conductive electrodes for electrochromic devices: A review

TL;DR: In this article, the optical and electrical properties of thin films that are useful as transparent electrodes in electrochromic devices are discussed, and the properties of certain heavily doped widebandgap semiconductor oxides (especially In2O3:Sn) and of metal films are discussed.
Journal ArticleDOI

The resistivity of thin metal films—Some critical remarks

TL;DR: In this article, the authors highlight the problems associated with interpreting data on the resistivity of thin thin films and point out that extreme care must be taken in analysing data and a thorough study should be made of the morphology of the films from which data are taken.
Journal ArticleDOI

Individual carbon nanotube soldering with gold nanoink deposition

TL;DR: In this article, a fountain pen-based method for soldering carbon nanotubes lying on microfabricated metal pads is presented. Butts et al. used a capillary tube that was pulled into a micropipette with the tip outer diameter of 2μm.
Journal ArticleDOI

Ion assisted deposition of thermally evaporated Ag and Al films.

TL;DR: In this paper, optical, electrical, and microstructural effects of Ar-ion bombardment and incorporation on thermally evaporated Ag and Al thin films are investigated, and the results show that as the momentum supplied to the growing films by the bombarding ions per arriving metal atom increases, the refractive index at 632.8 nm increases and the extinction coefficient decreases, lattice spacing expands, grain size decreases, electrical resistivity increases, and trapped Ar increases slightly.
Journal ArticleDOI

Surface scattering of electrons in metals

TL;DR: In this paper, the Fuchs-Namba model was applied to evaluate the specularity of point defects on the surface of copper films with nickel atoms, and the increase in the resistivity with increasing coating by nickel atoms allowed a quantitative determination of the related scattering cross section.
References
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Journal ArticleDOI

The mean free path of electrons in metals

TL;DR: The mean free path of electrons in metals has been studied in this paper, where the authors show that electrons follow a straight line along the path of the electron in the metal atom.
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Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External Surfaces

A. F. Mayadas, +1 more
- 15 Feb 1970 - 
TL;DR: In this paper, the total resistivity of a thin metal film is calculated from a model in which three types of electron scattering mechanisms are simultaneously operative: an isotropic background scattering (due to the combined effects of phonons and point defects), scattering due to a distribution of planar potentials (grain boundaries), and scattering by the external surfaces.
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Resistivity and Temperature Coefficient of Thin Metal Films with Rough Surface

TL;DR: In this paper, the surface roughness of thin metal films has been used to predict the thickness dependence of resistivity and its temperature coefficient of metal films, and the ratio of the roughness to the mean free path, h/λ, is introduced as a convenient parameter.
Journal ArticleDOI

Critical assessment of thickness-dependent conductivity of thin metal films

TL;DR: In this article, the possibility of determining transport parameters for the electrical conductivity from its dependence on the film thickness (size effect) is discussed, and the experimental curves have to be fitted for very small film thickness to permit a separation of these parameters.
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