Journal ArticleDOI
Silicon‐On‐Insulator by Wafer Bonding: A Review
Reads0
Chats0
TLDR
In this article, the structural and electrical properties of state-of-the-art SOI silicon films and devices built in them are described and problems faced by this technology are evaluated.Abstract:
Various approaches to wafer bonding technology are reviewed. Bonding kinetics are discussed as well as different mechanical and chemical thinning techniques. The structural and electrical qualities of state‐of‐the‐art bonded SOI silicon films and devices built in them are detailed. Problems faced by this technology are evaluated.read more
Citations
More filters
Journal ArticleDOI
Semiconductor wafer bonding
Ulrich Gösele,Q. Y. Tong +1 more
TL;DR: Wafer bonding allows a new degree of freedom in design and fabrication of material combinations that previously would have been excluded because these material combinations cannot be realized by the conventional approach of epitaxial growth.
Journal ArticleDOI
Materials issues in microelectromechanical systems (MEMS)
TL;DR: In this article, the status of microelectromechanical systems (MEMS) is reviewed with particular emphasis on materials issues therein, and the potential impact of materials solutions is discussed.
Journal ArticleDOI
III‐V/silicon photonics for on‐chip and intra‐chip optical interconnects
Gunther Roelkens,Liu Liu,Di Liang,Richard Jones,Alexander W. Fang,Brian R. Koch,John E. Bowers +6 more
TL;DR: In this paper, two bonding technologies are used to realize the III-V/SOI integration: one based on molecular wafer bonding and the other based on DVS-BCB adhesive wafer-bonding.
Patent
Process for producing semiconductor article
TL;DR: In this article, a process for producing a semiconductor article is provided which comprises the steps of bonding a film onto a substrate having a porous semiconductor layer, and separating the film from the substrate at the porous layer by applying a force to the film in a peeling direction.
Journal ArticleDOI
Wafer-to-wafer bonding for microstructure formation
TL;DR: Wafer-to-wafer bonding processes for microstructure fabrication are categorized and described in this article, which have an impact in packaging and structure design, including direct bonds, anodic bonds and bonds with intermediate layers.