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Journal ArticleDOI

Temperature-dependent thermal conductivity of porous silicon

TLDR
In this paper, the thermal conductivity of electrochemically etched porous silicon (PS) layers was determined over a wide temperature range (T = 35 - 320 K) using the dynamic technique.
Abstract
The thermal conductivity of electrochemically etched porous silicon (PS) layers was determined over a wide temperature range (T = 35 - 320 K) using the dynamic technique. Both the doping level of the silicon wafers (p and ) and the porosity P of the porous layers (P = 64 - 89%) were varied. The measured thermal conductivities were three to five orders of magnitude smaller than the values for bulk silicon. Furthermore, they increase with increasing the wafer doping level and with decreasing the porosity P of the layers. For all investigated PS layers the thermal conductivity increases with temperature. The results are discussed in terms of a simple model for heat conduction in PS based on the phonon diffusion model.

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Journal ArticleDOI

Holey Silicon as an Efficient Thermoelectric Material

TL;DR: In this article, the authors investigated the thermoelectric properties of thin silicon membranes that have been decorated with high density of nanoscopic holes and showed that by reducing the pitch of the hexagonal holey pattern down to 55 nm with 35% porosity, the thermal conductivity of HS is consistently reduced by 2 orders of magnitude and approaches the amorphous limit.
Journal ArticleDOI

Advances in thermoelectrics

TL;DR: In this article, a thermoelectric generator is used to directly convert heat into electricity, which holds great promise for tackling the ever-increasing energy sustainability issue in the future.
Journal ArticleDOI

Nanoporous Si as an Efficient Thermoelectric Material

TL;DR: It is found that while alignment of pores is necessary to preserve power factor values comparable to those of bulk Si, a symmetric arrangement is not required, indicating that nanoporous semiconductors with aligned pores may be highly attractive materials for thermoelectric applications.
Journal ArticleDOI

Frequency-dependent Monte Carlo simulations of phonon transport in two-dimensional porous silicon with aligned pores

TL;DR: In this paper, a boundary condition based on the periodic heat flux with constant virtual wall temperature is developed for the studied periodic structures, which enable the simulation of the lattice thermal conductivities with a minimum computational domain.
Journal ArticleDOI

Thermal conductivity of periodic microporous silicon films

D. W. Song, +1 more
TL;DR: In this paper, the experimental in-plane thermal conductivity of microfabricated, free-standing, single-crystal silicon thin films with periodically arranged through-film micropores was investigated.
References
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Journal ArticleDOI

Silicon quantum wire array fabrication by electrochemical and chemical dissolution of wafers

TL;DR: In this paper, free standing Si quantum wires can be fabricated without the use of epitaxial deposition or lithography using electrochemical and chemical dissolution steps to define networks of isolated wires out of bulk wafers.
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Thermal conductivity measurement from 30 to 750 K: the 3ω method

TL;DR: An ac technique for measuring the thermal conductivity of dielectric solids between 30 and 750 K is described in this article, which can be applied to bulk amorphous solids and crystals.
Journal ArticleDOI

Dielectric constants of heterogeneous mixtures.

TL;DR: In this paper, the Bruggeman and Bottcher equation for the dielectric constant of a heterogeneous system is reconsidered and a theoretical model is designed from which both formulae can be derived.
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Porous silicon formation mechanisms

TL;DR: In this article, various models describing porous silicon formation are reviewed and the known electrochemical and morphological properties are discussed with the intention of unifying the different models into a comprehensive explanation for the formation of a porous structure in silicon.
Journal ArticleDOI

Thermal conductivity of thin films: Measurements and understanding

TL;DR: In this paper, thermal conductivity and phonon scattering can be measured in films of thicknesses ranging from angstroms to millimeters, and it is shown that phonons are very sensitive probes of the structural perfection of the films.
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