Journal ArticleDOI
The effects of rheological and wetting properties on underfill filler settling and flow voids in flip chip packages.
TLDR
How the rheological properties can affect underfill filler settling and flow voids is discussed and it was shown that the underfills with small fillers have shear-thickening viscosity and yield stress.About:
This article is published in Microelectronics Reliability.The article was published on 2007-12-01. It has received 40 citations till now.read more
Citations
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Journal ArticleDOI
High-performance epoxy/silica coated silver nanowire composites as underfill material for electronic packaging
TL;DR: In this article, a silica-coated silver nanowires (AgNWs@SiO2) were synthesized by a flexible sol-gel method and then incorporated into epoxy.
Journal ArticleDOI
FVM based numerical study on the effect of solder bump arrangement on capillary driven flip chip underfill process
TL;DR: In this article, a finite volume method (FVM) based numerical simulation is used for the flow visualization of capillary driven underfill process for different solder bump arrangements of flip chip packages is presented.
Journal ArticleDOI
Effect of coupling agents on thermal, flow, and adhesion properties of epoxy/silica compounds for capillary underfill applications
Gun-Young Heo,Soo-Jin Park +1 more
TL;DR: In this paper, the effects of the type of coupling agent in the epoxy/silica compounds on thermal, flow and adhesion properties were investigated by differential scanning calorimetry (DSC).
Journal ArticleDOI
Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process
TL;DR: The strength of CFD software in handling underfill encapsulation problems is proved to be excellent and the U-type injection is found to be faster in filling than central point, one line, L-type and U-types.
Journal ArticleDOI
Synthesis and properties of two novel silicon‐containing cycloaliphatic epoxy resins for electronic packaging application
TL;DR: In this paper, two silicon-containing cycloaliphatic olefins were synthesized through the nucleophilic substitution reactions of cyclohex-3-enyl-1-methanol with di- or tri-chlorosilane compounds.
References
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Journal ArticleDOI
The Dynamics of Capillary Flow
TL;DR: In this article, the rate of penetration into a small cylindrical capillary of radius $r$ was shown to be: ρ(r}^{2}+4\ensuremath{\epsilon}r)
Book
An Introduction To Rheology
TL;DR: In this article, the authors discuss the importance of non-linearity solids and liquids rheology is a difficult subject for rheological research, and present some demonstrations of high extensional viscosity behaviour.
Book
Bubbles, Drops, and Particles in Non-Newtonian Fluids
TL;DR: In this paper, the authors present a detailed discussion of non-Newtonian fluid behavior in the context of Viscoelastic Fluid Dynamics, including the role of velocity-volume behavior in free rise or fall.
Book
Introduction to Rheology
TL;DR: In this paper, the authors discuss the importance of non-linearity solids and liquids rheology is a difficult subject for rheological research, and present some demonstrations of high extensional viscosity behaviour.
Journal ArticleDOI
Analysis of the flow of encapsulant during underfill encapsulation of flip-chips
Sejin Han,K.K. Wang +1 more
TL;DR: In this article, the flow of encapsulant during underfill encapsulation of flip-chips has been studied and analytical and numerical methods have been developed to analyze the flow.
Related Papers (5)
Recent advances in modeling the underfill process in flip-chip packaging
Recent advances in flip-chip underfill: materials, process, and reliability
Zhuqing Zhang,Ching-Ping Wong +1 more