Proceedings ArticleDOI
Thermal fatigue reliability enhancement of plastic ball grid array (PBGA) packages
A.R. Syed
- pp 1211-1216
TLDR
In this article, a combined design of experiment and numerical analysis approach is used to determine the effect of four design parameters on the thermal fatigue life of solder joints, including substrate thickness, array configuration, ball pitch, acid pad size.Abstract:
A combined design of experiment and numerical analysis approach is used to determine the effect of four design parameters on the thermal fatigue life of solder joints. The four parameters considered were: substrate thickness, array configuration, ball pitch, acid pad size. A full factorial experiment was designed which was conducted numerically. A validated life prediction model was then used to determine the fatigue lives for each combination. Up to a factor of five improvement in fatigue life is predicted when these parameters were changed from one level to another.read more
Citations
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Life Prediction Model of Electronics Subjected to Thermo-Mechanical Environments
TL;DR: In this article, the authors present a list of figures and tables for a series of tables and figures of the same type: https://www.dropbox.com/index.html
Proceedings ArticleDOI
An Efficient Method for Assessing Board Level Reliability for Micro-electronic Packages using Combined Experimental — Numerical Techniques
TL;DR: In this article, a new method was developed for modeling electronic packages, which is applied to a BGA 256 on board and compared to measured results of a thermal cycle test and a thermal shock test.
DissertationDOI
Mechanics of materials characterization of lead-free solders.
TL;DR: In this paper, the NEMI recommended Pb-free solder alloys, namely Sn-3.8Ag-0.7Cu and Sn- 0.7cu, were evaluated at different tensile tests at four different temperatures and strain rates.
Proceedings ArticleDOI
Principal components regression model for prediction of life-reduction in SAC leadfree interconnects during long-term high temperature storage
TL;DR: In this article, accelerated test thermal cycle data collected on SAC leadfree assemblies subjected to high temperature thermal aging for period of up to 1-year has been used for development of model for prediction of life reduction from long term storage at elevated temperatures.
Proceedings ArticleDOI
Finite element-based lifetime modelling of SAC solder joints in LED applications
TL;DR: In this article, a model is developed to predict the lifetime of SAC305 solder joint in a LED on board setup using accelerated tests and finite element modelling where crack length is the failure criterion and the accumulated creep strain is the computational failure parameter to quantify damage.
References
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Book
Cooling techniques for electronic equipment
TL;DR: In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.
Journal ArticleDOI
A creep-rupture model for two-phase eutectic solders
B. Wong,D.E. Helling,R.W. Clark +2 more
TL;DR: In this paper, an analytical framework to predict failure of solders under creep conditions is proposed, based on both micromechanics and fracture mechanics, and the general agreement between the model predictions and reported creep-rupture data in the literature for lead/tin eutectic solder indicates that the mode and mechanisms proposed in the model may control the solder creeprupture process.
Book ChapterDOI
Fatigue of solder joints in surface mount devices
TL;DR: In this paper, a 16-I/O surface-mounted solder joint array undergoing isothermal cyclic fatigue in torsion shear under fixed plastic strain range showed a strong correlation with creep fatigue and a creepcracking mechanism.
Journal ArticleDOI
Creep Crack Growth Prediction of Solder Joints During Temperature Cycling—An Engineering Approach
TL;DR: In this paper, a model is developed which predicts the creep damage accumulation in solder joints during temperature cycling, and the model relates the crack growth rate to the rate of creep energy density dissipated using the C* parameter of nonlinear fracture mechanics for extensive creep damage.