Proceedings ArticleDOI
Thermal fatigue reliability enhancement of plastic ball grid array (PBGA) packages
A.R. Syed
- pp 1211-1216
TLDR
In this article, a combined design of experiment and numerical analysis approach is used to determine the effect of four design parameters on the thermal fatigue life of solder joints, including substrate thickness, array configuration, ball pitch, acid pad size.Abstract:
A combined design of experiment and numerical analysis approach is used to determine the effect of four design parameters on the thermal fatigue life of solder joints. The four parameters considered were: substrate thickness, array configuration, ball pitch, acid pad size. A full factorial experiment was designed which was conducted numerically. A validated life prediction model was then used to determine the fatigue lives for each combination. Up to a factor of five improvement in fatigue life is predicted when these parameters were changed from one level to another.read more
Citations
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Journal Article
Critical Issues in Computational Modeling and Fatigue Life Analysisfor PBGA Solder Joints
Xiaowu Zhang,Shi Wei Ricky Lee +1 more
TL;DR: In this article, a nonlinear Finite Element model is used to investigate the effects of variation in material properties, the lifetime analysis index and the temperature profile on the fatigue life of solder joints of a Plastic Ball Grid Array (PBGA) assembly subjected to cyclic therm al loading.
Journal ArticleDOI
Designing for reliability using a new Wafer Level Package structure
TL;DR: An improved construction that significantly outperforms current solutions is designed and manufactured using combined experimental and virtual prototyping techniques on understanding and enhancing the 1st and 2nd level reliability of Wafer Level Packages.
Proceedings ArticleDOI
Principal component regression models for life prediction of plastic ball grid arrays on copper-core and no-core assemblies
TL;DR: The models presented in this paper provide decision guidance for smart selection and substitution to address component obsolescence by perturbing product designs for minimal risk insertion of new packaging technologies by using principal component regression models.
Proceedings ArticleDOI
Virtual prototyping and qualification of board level assembly
TL;DR: In this paper, a new and innovative approach to accurately predict the board level performance of micro-electronic packages is proposed, which uses contact bodies, time-and temperature-dependent material properties, precisely modeling the shape of critical solder joints, and beam elements for other joints.
References
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Book
Cooling techniques for electronic equipment
TL;DR: In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.
Journal ArticleDOI
A creep-rupture model for two-phase eutectic solders
B. Wong,D.E. Helling,R.W. Clark +2 more
TL;DR: In this paper, an analytical framework to predict failure of solders under creep conditions is proposed, based on both micromechanics and fracture mechanics, and the general agreement between the model predictions and reported creep-rupture data in the literature for lead/tin eutectic solder indicates that the mode and mechanisms proposed in the model may control the solder creeprupture process.
Book ChapterDOI
Fatigue of solder joints in surface mount devices
TL;DR: In this paper, a 16-I/O surface-mounted solder joint array undergoing isothermal cyclic fatigue in torsion shear under fixed plastic strain range showed a strong correlation with creep fatigue and a creepcracking mechanism.
Journal ArticleDOI
Creep Crack Growth Prediction of Solder Joints During Temperature Cycling—An Engineering Approach
TL;DR: In this paper, a model is developed which predicts the creep damage accumulation in solder joints during temperature cycling, and the model relates the crack growth rate to the rate of creep energy density dissipated using the C* parameter of nonlinear fracture mechanics for extensive creep damage.