Proceedings ArticleDOI
Thermal fatigue reliability enhancement of plastic ball grid array (PBGA) packages
A.R. Syed
- pp 1211-1216
TLDR
In this article, a combined design of experiment and numerical analysis approach is used to determine the effect of four design parameters on the thermal fatigue life of solder joints, including substrate thickness, array configuration, ball pitch, acid pad size.Abstract:
A combined design of experiment and numerical analysis approach is used to determine the effect of four design parameters on the thermal fatigue life of solder joints. The four parameters considered were: substrate thickness, array configuration, ball pitch, acid pad size. A full factorial experiment was designed which was conducted numerically. A validated life prediction model was then used to determine the fatigue lives for each combination. Up to a factor of five improvement in fatigue life is predicted when these parameters were changed from one level to another.read more
Citations
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Journal ArticleDOI
A study on the electrical resistance of solder joint interconnections
De-Shin Liu,Chin-Yu Ni +1 more
TL;DR: In this article, an analytical model of equivalent solder joint interconnection resistors was developed to predict the variety in the electrical resistance with various combinations of vertical and shear strains at different environmental temperatures.
Journal ArticleDOI
Damage Metric-Based Mapping Approaches for Developing Accelerated Thermal Cycling Guidelines for Electronic Packages:
TL;DR: The accumulated equivalent inelastic strain per cycle and the maximum strain energy density over one cycle have been used as damage metrics to map the solder fatigue damage during Field-Cycling as mentioned in this paper.
Proceedings ArticleDOI
Comparative study on solder joint reliability using different FE-models
TL;DR: In this article, finite element analysis (FEA) models, 3D-slice model and 1/8 or octant model, were used to simulate the solder joint reliability of ball grid array (BGA) packages.
Proceedings ArticleDOI
Design for Reliability of Wafer Level Packages
TL;DR: In this paper, the 1st and 2nd level reliability of wafer level packages using combined experimental and virtual prototyping (thermal, mechanical and thermo-mechanical) techniques is investigated.
References
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Book
Cooling techniques for electronic equipment
TL;DR: In this article, the authors present practical guides for Natural Convection and Radiation Cooling for Electronic Components. But they do not consider the effects of thermal stresses in lead wires, Solder Joints and Plated Throughholes.
Journal ArticleDOI
A creep-rupture model for two-phase eutectic solders
B. Wong,D.E. Helling,R.W. Clark +2 more
TL;DR: In this paper, an analytical framework to predict failure of solders under creep conditions is proposed, based on both micromechanics and fracture mechanics, and the general agreement between the model predictions and reported creep-rupture data in the literature for lead/tin eutectic solder indicates that the mode and mechanisms proposed in the model may control the solder creeprupture process.
Book ChapterDOI
Fatigue of solder joints in surface mount devices
TL;DR: In this paper, a 16-I/O surface-mounted solder joint array undergoing isothermal cyclic fatigue in torsion shear under fixed plastic strain range showed a strong correlation with creep fatigue and a creepcracking mechanism.
Journal ArticleDOI
Creep Crack Growth Prediction of Solder Joints During Temperature Cycling—An Engineering Approach
TL;DR: In this paper, a model is developed which predicts the creep damage accumulation in solder joints during temperature cycling, and the model relates the crack growth rate to the rate of creep energy density dissipated using the C* parameter of nonlinear fracture mechanics for extensive creep damage.