Journal ArticleDOI
Thermal issues in next-generation integrated circuits
TLDR
In this paper, the authors systematically explore the limits for heat removal from a model chip in various configurations, and identify bottlenecks in the thermal performance of current generation packages and motivate lowering of thermal resistance through the board-side for efficient heat removal to meet ever increasing reliability and performance requirements.Abstract:
The drive for higher performance has led to greater integration and higher clock frequency of microprocessor chips. This translates into higher heat dissipation and, therefore, effective cooling of electronic chips is becoming increasingly important for their reliable performance. We systematically explore the limits for heat removal from a model chip in various configurations. First, the heat removal from a bare chip by pure heat conduction and convection is studied to establish the theoretical limit of heat removal from a bare die bound by an infinite medium. This is followed by an analysis of heat removal from a packaged chip by evaluating the thermal resistance due to individual packaging elements. The analysis results allow us to identify the bottlenecks in the thermal performance of current generation packages, and to motivate lowering of thermal resistance through the board-side for efficient heat removal to meet ever increasing reliability and performance requirements.read more
Citations
More filters
Patent
Nano-patch thermal management devices, methods, & systems
TL;DR: In this article, a thermal management device configured to remove heat from a heated area can comprise an inlet port and a cavity, which can be positioned intermediate a heat source and an opposing surface spaced apart from the heat source.
Journal ArticleDOI
Thermomagnetic Convection in Square and Shallow Enclosures for Electronics Cooling
TL;DR: In this article, a comparative numerical analysis of steady-state convection carried out for a square and a shallow enclosure under zero-gravity conditions was carried out, where two symmetrically placed, discrete, constant-flux flush-mounted heaters on the bottom wall of the cavities represent power-dissipating devices in electronics/MEMS applications.
Journal ArticleDOI
Effect of in-situ formed Y2O3 by metal hydride reduction reaction on thermal conductivity of β-Si3N4 ceramics
TL;DR: In this paper, the effect of YH2 on densification, microstructure, and thermal conductivity of Si3N4 ceramics was investigated by adjusting the amount of YO3 in the range of 0 to 4wt% using a two-step sintering method.
Proceedings ArticleDOI
Extending the limits of air-cooling in microelectronic equipment
TL;DR: In this article, the authors review approaches that could maintain the effectiveness of air-cooling technology, including heat sink design and analysis, interface thermal resistance minimization, heat spreading, fan performance, hybrid thermal management, heat sink surface fouling, and sustainability.
Journal ArticleDOI
Synthesis of sub-10-nm Sn nanoparticles from Sn(II) 2-ethylhexanoate by a modified polyol process and preparation of AgSn film by melting of the Sn nanoparticles
Sang-Soo Chee,Jong-Hyun Lee +1 more
TL;DR: In this article, a modified polyol process was used to synthesize ultrafine nanoparticles (NPs) with an average diameter of 7.98 nm and an extremely low melting point of 128 °C.
References
More filters
Book
Fundamentals of Heat and Mass Transfer
TL;DR: This paper introduced the physical effects underlying heat and mass transfer phenomena and developed methodologies for solving a variety of real-world problems, such as energy minimization, mass transfer, and energy maximization.
Thermal Performance Challenges from Silicon to Systems
TL;DR: In this paper, the authors highlight design and technology challenges encountered in mobile computers, desktops, and servers with respect to thermal design for a microprocessor and highlight the concurrent development and packaging of all these elements to ensure that a viable thermal design solution space exists.
Journal ArticleDOI
Performance and testing of thermal interface materials
J.P Gwinn,R.L Webb +1 more
TL;DR: A state-of-the-art assessment on ‘thermal interface materials’, including fundamentals, materials used, their performance, and how interface resistance is measured is provided.
Journal ArticleDOI
Spreading Resistance of Isoflux Rectangles and Strips on Compound Flux Channels
TL;DR: The general expression for the spreading resistance of an isoe ux, rectangular heat source on a two-layer rectangular channel with convective or conductive cooling at one boundary is presented in this article.
Proceedings ArticleDOI
Analysis of a thermally enhanced ball grid array package
TL;DR: In this paper, a thermally enhanced ball grid array (SuperBGA) was developed and its thermal performance was analyzed using a non-linear, lumped-parameter model.