Journal ArticleDOI
Thermal issues in next-generation integrated circuits
TLDR
In this paper, the authors systematically explore the limits for heat removal from a model chip in various configurations, and identify bottlenecks in the thermal performance of current generation packages and motivate lowering of thermal resistance through the board-side for efficient heat removal to meet ever increasing reliability and performance requirements.Abstract:
The drive for higher performance has led to greater integration and higher clock frequency of microprocessor chips. This translates into higher heat dissipation and, therefore, effective cooling of electronic chips is becoming increasingly important for their reliable performance. We systematically explore the limits for heat removal from a model chip in various configurations. First, the heat removal from a bare chip by pure heat conduction and convection is studied to establish the theoretical limit of heat removal from a bare die bound by an infinite medium. This is followed by an analysis of heat removal from a packaged chip by evaluating the thermal resistance due to individual packaging elements. The analysis results allow us to identify the bottlenecks in the thermal performance of current generation packages, and to motivate lowering of thermal resistance through the board-side for efficient heat removal to meet ever increasing reliability and performance requirements.read more
Citations
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Journal ArticleDOI
Ultra-compact photodetection in atomically thin MoSe$_2$
M. Blauth,Gwenaelle Vest,S. Loukkose Rosemary,Maximilian Prechtl,Oliver Hartwig,Marius Jürgensen,Michael Kaniber,Andreas V. Stier,Jonathan J. Finley +8 more
TL;DR: In this paper, the authors exploit the deep subwavelength confinement of surface plasmon polaritons (SPPs) at the edge of a metal-insulator-plasmonic waveguide and their proximity of 2D excitons in an adjacent atomically thin semiconductor to build an ultra-compact photodetector.
Journal ArticleDOI
Natural Convection From Interrupted Vertical Walls
TL;DR: In this article, the effect of fin interruptions on convection heat transfer from interrupted rectangular vertical walls is investigated. And the authors show that fin interruption can enhance heat transfer rate up to 16% and reduce the weight of the fin.
Journal ArticleDOI
Thermal performance analysis of a novel linear LED housing with inner and outer fins
TL;DR: In this article, three different natural convection linear housing models were developed to cool mid-powered LED arrays, focusing on basic parameters such as fin structure, surface area, and wall thickness.
Journal ArticleDOI
Demonstration of hotspot cooling using digital microfluidic device
Journal ArticleDOI
Single-phase fluid flow and heat transfer characteristics of nanofluid in a circular microchannel: Development of flow and heat transfer correlations:
TL;DR: In this paper, convective heat transfer in microchannels with the use of nanofluids has proved to be a potential candidate for cooling of micro-electromechanical system devices.
References
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Book
Fundamentals of Heat and Mass Transfer
TL;DR: This paper introduced the physical effects underlying heat and mass transfer phenomena and developed methodologies for solving a variety of real-world problems, such as energy minimization, mass transfer, and energy maximization.
Thermal Performance Challenges from Silicon to Systems
TL;DR: In this paper, the authors highlight design and technology challenges encountered in mobile computers, desktops, and servers with respect to thermal design for a microprocessor and highlight the concurrent development and packaging of all these elements to ensure that a viable thermal design solution space exists.
Journal ArticleDOI
Performance and testing of thermal interface materials
J.P Gwinn,R.L Webb +1 more
TL;DR: A state-of-the-art assessment on ‘thermal interface materials’, including fundamentals, materials used, their performance, and how interface resistance is measured is provided.
Journal ArticleDOI
Spreading Resistance of Isoflux Rectangles and Strips on Compound Flux Channels
TL;DR: The general expression for the spreading resistance of an isoe ux, rectangular heat source on a two-layer rectangular channel with convective or conductive cooling at one boundary is presented in this article.
Proceedings ArticleDOI
Analysis of a thermally enhanced ball grid array package
TL;DR: In this paper, a thermally enhanced ball grid array (SuperBGA) was developed and its thermal performance was analyzed using a non-linear, lumped-parameter model.