Journal ArticleDOI
Thermal issues in next-generation integrated circuits
TLDR
In this paper, the authors systematically explore the limits for heat removal from a model chip in various configurations, and identify bottlenecks in the thermal performance of current generation packages and motivate lowering of thermal resistance through the board-side for efficient heat removal to meet ever increasing reliability and performance requirements.Abstract:
The drive for higher performance has led to greater integration and higher clock frequency of microprocessor chips. This translates into higher heat dissipation and, therefore, effective cooling of electronic chips is becoming increasingly important for their reliable performance. We systematically explore the limits for heat removal from a model chip in various configurations. First, the heat removal from a bare chip by pure heat conduction and convection is studied to establish the theoretical limit of heat removal from a bare die bound by an infinite medium. This is followed by an analysis of heat removal from a packaged chip by evaluating the thermal resistance due to individual packaging elements. The analysis results allow us to identify the bottlenecks in the thermal performance of current generation packages, and to motivate lowering of thermal resistance through the board-side for efficient heat removal to meet ever increasing reliability and performance requirements.read more
Citations
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Journal ArticleDOI
Experimental investigation of rectangular mini channel array as an effective tool for energy efficient cooling of electronic gadgets
TL;DR: In this article , an experimental investigation of heat transfer and fluid flow analysis of rectangular mini channel array under steady flow condition is carried out, where the channel dimensions are selected in such a way that, flow within the channel is maintained hydro dynamically developed and thermally developing.
Optimized Designs and Materials for Nanostructure Based Solar Cells
TL;DR: In this article, the authors presented results of the theoretical, computational and experimental investigation of novel designs for quantum dot superlattice (QDS) based PV elements and advanced materials for transparent solar cells.
Dissertation
Run-time Predictive Modeling of Power and Performance via Time-Series in High Performance Computing
TL;DR: Thesis (Ph.D, Electrical & Computer Engineering) -- Queen's University, 2012-11-12 12-21-00.152
Journal ArticleDOI
Air‐sensitive HfSe 2 ‐based temperature indicator for two‐dimensional electronic devices
TL;DR: In this paper , the van der Waals integrated HfSe2 was used to indicate surface temperature distribution in 2D electronics, and the results showed that the air oxidation of HfSE2 is sensitive to its thickness and ambient temperatures, with the resulting oxidation products varying accordingly.
Journal ArticleDOI
Theoretical upper limits of the thermal conductivity of Si3N4
Hao Zhou,Tianli Feng +1 more
TL;DR: In this article , the theoretical upper bound of κ for Si3N4 was shown to be only 169 and 57 W/mK along the c and a axes at room temperature, respectively.
References
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Book
Fundamentals of Heat and Mass Transfer
TL;DR: This paper introduced the physical effects underlying heat and mass transfer phenomena and developed methodologies for solving a variety of real-world problems, such as energy minimization, mass transfer, and energy maximization.
Thermal Performance Challenges from Silicon to Systems
TL;DR: In this paper, the authors highlight design and technology challenges encountered in mobile computers, desktops, and servers with respect to thermal design for a microprocessor and highlight the concurrent development and packaging of all these elements to ensure that a viable thermal design solution space exists.
Journal ArticleDOI
Performance and testing of thermal interface materials
J.P Gwinn,R.L Webb +1 more
TL;DR: A state-of-the-art assessment on ‘thermal interface materials’, including fundamentals, materials used, their performance, and how interface resistance is measured is provided.
Journal ArticleDOI
Spreading Resistance of Isoflux Rectangles and Strips on Compound Flux Channels
TL;DR: The general expression for the spreading resistance of an isoe ux, rectangular heat source on a two-layer rectangular channel with convective or conductive cooling at one boundary is presented in this article.
Proceedings ArticleDOI
Analysis of a thermally enhanced ball grid array package
TL;DR: In this paper, a thermally enhanced ball grid array (SuperBGA) was developed and its thermal performance was analyzed using a non-linear, lumped-parameter model.