Journal ArticleDOI
Thermal issues in next-generation integrated circuits
TLDR
In this paper, the authors systematically explore the limits for heat removal from a model chip in various configurations, and identify bottlenecks in the thermal performance of current generation packages and motivate lowering of thermal resistance through the board-side for efficient heat removal to meet ever increasing reliability and performance requirements.Abstract:
The drive for higher performance has led to greater integration and higher clock frequency of microprocessor chips. This translates into higher heat dissipation and, therefore, effective cooling of electronic chips is becoming increasingly important for their reliable performance. We systematically explore the limits for heat removal from a model chip in various configurations. First, the heat removal from a bare chip by pure heat conduction and convection is studied to establish the theoretical limit of heat removal from a bare die bound by an infinite medium. This is followed by an analysis of heat removal from a packaged chip by evaluating the thermal resistance due to individual packaging elements. The analysis results allow us to identify the bottlenecks in the thermal performance of current generation packages, and to motivate lowering of thermal resistance through the board-side for efficient heat removal to meet ever increasing reliability and performance requirements.read more
Citations
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Journal ArticleDOI
Performance of Online and Offset Micro Pin-Fin Heat Sinks With Variable Fin Density
TL;DR: In this article, a comparison of the performances of online and offset micro pin-fin heat sinks with variable fin density is given in comparison with other cooling devices reported in the technical literature.
Journal ArticleDOI
The Nanocell: A Chemically Assembled Molecular Electronic Circuit
TL;DR: In this paper, the authors focus on the description, advances, and possibilities of the nanocell approach, which takes advantage of the great skills developed by chemists to synthesize molecules with precise arrangements of atoms in a molecule.
Journal ArticleDOI
A numerical investigation of the thermal-hydraulic characteristics of perforated plate fin heat sinks
TL;DR: In this paper, the benefits of using notch, slot and multiple circular perforations in plate fin heat sinks (PFHSs) were investigated numerically, using a conjugate heat transfer model.
Journal ArticleDOI
A numerical and experimental investigation of heat transfer and fluid flow characteristics of a cross-connected alternating converging–diverging channel heat sink
TL;DR: In this paper, the conjugate heat transfer performance of an enhanced planar heat sink design, comprising cross-connected alternating converging-diverging channels, was analyzed for forced air convection conditions.
Journal ArticleDOI
Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management
TL;DR: In this paper, an innovative heat sink design aimed at meeting both the hot spot and large background heat flux requirements of next generation integrated circuits is presented, which utilizes two separate unmixed fluids to meet the cooling requirements of the chip with one fluid acting as a fluidic spreader dedicated to cooling the hot spots only while the second fluid serves as both a coolant for the background heat flow and an on-chip regenerator for hot spot fluid.
References
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Book
Fundamentals of Heat and Mass Transfer
TL;DR: This paper introduced the physical effects underlying heat and mass transfer phenomena and developed methodologies for solving a variety of real-world problems, such as energy minimization, mass transfer, and energy maximization.
Thermal Performance Challenges from Silicon to Systems
TL;DR: In this paper, the authors highlight design and technology challenges encountered in mobile computers, desktops, and servers with respect to thermal design for a microprocessor and highlight the concurrent development and packaging of all these elements to ensure that a viable thermal design solution space exists.
Journal ArticleDOI
Performance and testing of thermal interface materials
J.P Gwinn,R.L Webb +1 more
TL;DR: A state-of-the-art assessment on ‘thermal interface materials’, including fundamentals, materials used, their performance, and how interface resistance is measured is provided.
Journal ArticleDOI
Spreading Resistance of Isoflux Rectangles and Strips on Compound Flux Channels
TL;DR: The general expression for the spreading resistance of an isoe ux, rectangular heat source on a two-layer rectangular channel with convective or conductive cooling at one boundary is presented in this article.
Proceedings ArticleDOI
Analysis of a thermally enhanced ball grid array package
TL;DR: In this paper, a thermally enhanced ball grid array (SuperBGA) was developed and its thermal performance was analyzed using a non-linear, lumped-parameter model.