Journal ArticleDOI
Thermal issues in next-generation integrated circuits
TLDR
In this paper, the authors systematically explore the limits for heat removal from a model chip in various configurations, and identify bottlenecks in the thermal performance of current generation packages and motivate lowering of thermal resistance through the board-side for efficient heat removal to meet ever increasing reliability and performance requirements.Abstract:
The drive for higher performance has led to greater integration and higher clock frequency of microprocessor chips. This translates into higher heat dissipation and, therefore, effective cooling of electronic chips is becoming increasingly important for their reliable performance. We systematically explore the limits for heat removal from a model chip in various configurations. First, the heat removal from a bare chip by pure heat conduction and convection is studied to establish the theoretical limit of heat removal from a bare die bound by an infinite medium. This is followed by an analysis of heat removal from a packaged chip by evaluating the thermal resistance due to individual packaging elements. The analysis results allow us to identify the bottlenecks in the thermal performance of current generation packages, and to motivate lowering of thermal resistance through the board-side for efficient heat removal to meet ever increasing reliability and performance requirements.read more
Citations
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Journal ArticleDOI
3-Dimensional numerical optimization of silicon-based high performance parallel microchannel heat sink with liquid flow
Ji Li,G. P. Peterson +1 more
TL;DR: In this article, a semi-normalized 3D conjugate heat transfer model has been developed, validated and used to optimize the geometric structure of these types of microheat sinks.
Journal ArticleDOI
Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips
TL;DR: In this article, the authors report the fabrication, assembly, and testing of a silicon chip with complementary metaloxide-semiconductor process compatible microchannel heat sink and thermofluidic chip input/output (I/O) interconnects fabricated using wafer-level batch processing.
Journal ArticleDOI
An experimental and computational investigation of thermal air flows through perforated pin heat sinks
TL;DR: The benefits of using pin fin heat sinks with multiple perforations using complementary experimental and Computational Fluid Dynamics (CFD) methods were investigated by as mentioned in this paper, which showed that the effect of perforated pin fin design on heat transfer and pressure drops across the heat sinks was found to agree with predictions from a CFD model for the conjugate heat transfer into the cooling air stream.
Journal ArticleDOI
MoS2 photodetectors integrated with photonic circuits
TL;DR: In this paper, the authors demonstrate the integration of an ultrasensitive MoS2 photodetector with a silicon nitride photonic circuit, which shows near-unity lateral absorption, which results in even higher responsivity.
Journal ArticleDOI
Capturing Anharmonicity in a Lattice Thermal Conductivity Model for High-Throughput Predictions
Samuel A. Miller,Prashun Gorai,Prashun Gorai,Brenden R. Ortiz,Anuj Goyal,Anuj Goyal,Duanfeng Gao,Scott A. Barnett,Thomas O. Mason,G. Jeffrey Snyder,Qin Lv,Vladan Stevanović,Vladan Stevanović,Eric S. Toberer,Eric S. Toberer +14 more
TL;DR: In this paper, a semi-empirical model for lattice thermal conductivity (κL) was developed and validated by fitting density functional theory calculations to experimental data, with accuracy similar to or better than the experimental value.
References
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Book
Fundamentals of Heat and Mass Transfer
TL;DR: This paper introduced the physical effects underlying heat and mass transfer phenomena and developed methodologies for solving a variety of real-world problems, such as energy minimization, mass transfer, and energy maximization.
Thermal Performance Challenges from Silicon to Systems
TL;DR: In this paper, the authors highlight design and technology challenges encountered in mobile computers, desktops, and servers with respect to thermal design for a microprocessor and highlight the concurrent development and packaging of all these elements to ensure that a viable thermal design solution space exists.
Journal ArticleDOI
Performance and testing of thermal interface materials
J.P Gwinn,R.L Webb +1 more
TL;DR: A state-of-the-art assessment on ‘thermal interface materials’, including fundamentals, materials used, their performance, and how interface resistance is measured is provided.
Journal ArticleDOI
Spreading Resistance of Isoflux Rectangles and Strips on Compound Flux Channels
TL;DR: The general expression for the spreading resistance of an isoe ux, rectangular heat source on a two-layer rectangular channel with convective or conductive cooling at one boundary is presented in this article.
Proceedings ArticleDOI
Analysis of a thermally enhanced ball grid array package
TL;DR: In this paper, a thermally enhanced ball grid array (SuperBGA) was developed and its thermal performance was analyzed using a non-linear, lumped-parameter model.