Proceedings ArticleDOI
Universal MEMS platforms for passive RF components: suspended inductors and variable capacitors
L. Fan,Richard T. Chen,Antonino Nespola,Ming C. Wu +3 more
- pp 29-33
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TLDR
In this article, a universal MEMS technology platform for fabricating integrable passive components for radio frequency (RF) integrated circuits is proposed based on a novel surface-micromachined Micro-Elevator by Self-Assembly (MESA) technique.Abstract:
We propose a universal MEMS technology platform for fabricating integrable passive components for radio frequency (RF) integrated circuits. This platform is based on a novel surface-micromachined Micro-Elevator by Self-Assembly (MESA) technique. Both high-Q inductors and variable capacitors can be realized by the MESA technology. A surface-micromachined spiral inductor that is raised by 250 /spl mu/m above the Si substrate has been experimentally demonstrated. The suspended inductor has less parasitic capacitance and substrate loss, and higher quality (Q) value and resonant frequency. The inductance of a 12.5-turn inductor is measured to be 24 nH. The results show that the self-assembled passive RF elements are suitable for monolithic integration.read more
Citations
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Journal ArticleDOI
RF MEMS from a device perspective
TL;DR: The recent progress in MEMS for radio frequency (RF) applications from a device perspective is reviewed in this article, where switches and relays, tunable capacitors, integrated inductors, mechanical resonators and filters, and some representative microwave and millimetre-wave components are discussed.
MonographDOI
RF MEMS and their applications
TL;DR: In this article, the authors present an integration and packaging for RF MEMS devices, including inductors and capacitors, phase shifters, and relay switches. But they do not discuss how to construct them.
Journal ArticleDOI
Review of radio frequency microelectromechanical systems technology
TL;DR: A review of radio frequency microelectromechanical systems (RF MEMS) technology, from the perspective of its enabling technologies (e.g., fabrication, RF micromachined components and actuation mechanisms) is presented in this paper.
Patent
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TL;DR: In this paper, a multi-port variable capacitor is described, where a movable plate is suspended above at least a first and a second, fixed, electrically-isolated electrode.
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High Q-large tuning range micro-electro mechanical system (MEMS) varactor for broadband applications
TL;DR: A Micro Electro-Mechanical System (MEMS) varactor with a bottom electrode (116) formed over a substrate (112) and a dielectric material (130) disposed over the bottom electrode is shown in this article.
References
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Journal ArticleDOI
Large suspended inductors on silicon and their use in a 2- mu m CMOS RF amplifier
TL;DR: In this paper, large spiral inductors encased in oxide over silicon are shown to operate beyond the UHF band when the capacitance and loss resistance are greatly reduced by selective removal of the underlying substrate.
Journal ArticleDOI
Si IC-compatible inductors and LC passive filters
N.M. Nguyen,Robert G. Meyer +1 more
TL;DR: In this paper, passive inductors and LC filters fabricated in standard Si IC technology are demonstrated, and Q-factors from three to eight and inductors up to 10 nH in the gigahertz range have been realized.
Journal ArticleDOI
SCREAM I: A single mask, single-crystal silicon, reactive ion etching process for microelectromechanical structures
TL;DR: In this paper, a single-crystal slhcon, high aspect ratlo, low-temperature process sequence for the fabelfcatlon of suspended movable smgle-crystals s&on (SCS) beam structures is presented.
Journal ArticleDOI
Planar microwave and millimeter-wave lumped elements and coupled-line filters using micro-machining techniques
Chen-Yu Chi,G.M. Rebiez +1 more
TL;DR: In this article, a planar microwave and millimeter-wave inductors and capacitors have been fabricated on high-resistivity silicon substrates using micro-machining techniques.
Proceedings ArticleDOI
Self-assembled microactuated XYZ stages for optical scanning and alignment
TL;DR: In this paper, a self-assembled surface-micromachined micro-XYZ stage with large displacements and fine positioning accuracy has been demonstrated on a Si microoptical bench for optical scanning/alignment applications.