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Vibration analysis for electronic equipment
TLDR
Vibrations of simple electronic systems lumped masses for electronic assemblies beam structures for electronic subassemblies electronic components, frames, and rings printed-circuit boards and flat plates preventing sinusoidal vibration failures understanding random vibration designing for shock environments designing electronic boxes vibration fixtures and vibration testing fatigue in electronic structures as mentioned in this paper.Abstract:
Vibrations of simple electronic systems lumped masses for electronic assemblies beam structures for electronic subassemblies electronic components, frames, and rings printed-circuit boards and flat plates preventing sinusoidal vibration failures understanding random vibration designing for shock environments designing electronic boxes vibration fixtures and vibration testing fatigue in electronic structures.read more
Citations
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MEMS Reliability Assurance Guidelines for Space Applications
TL;DR: In this paper, a reference for understanding the various aspects of microelectromechanical systems, or MEMS, with an emphasis on device reliability is provided, including material properties, failure mechanisms, processing techniques, device structures, and packaging techniques common to MEMS.
Journal ArticleDOI
Automated Parallel Recordings of Topologically Identified Single Ion Channels
Ryuji Kawano,Yutaro Tsuji,Koji Sato,Toshihisa Osaki,Koki Kamiya,Minako Hirano,Toru Ide,Norihisa Miki,Shoji Takeuchi +8 more
TL;DR: This automated methodology provides a high-throughput drug screening system for the targeting of ion channels and a data-intensive analysis technique for studying ion channel gating mechanisms.
Journal ArticleDOI
High-cycle fatigue life prediction for Pb-free BGA under random vibration loading
TL;DR: An assessment methodology based on vibration tests and finite element analysis (FEA) to predict the fatigue life of electronic components under random vibration loading and the calculated fatigue life based on the rainflow cycle counting results, the S–N curve, and the modified Miner’s rule agreed with actual testing results.
Journal ArticleDOI
Prognostics implementation of electronics under vibration loading
TL;DR: A methodology for monitoring, recording, and analyzing the life-cycle vibration loads for remaining-life prognostics of electronics and verified by the real-time to failure of the components by checking the components’ resistance data.
Proceedings ArticleDOI
Drop impact test - mechanics & physics of failure
TL;DR: In this article, the physics of failure in board-level drop impact have been investigated and three finite element analyses have been performed to understand the failure in drop impact: (i) velocity impact of a PCB -model as a beam; (ii) velocity impacts of a drop assembly with centrally mounted package and (iii) impacts of solid elements with submodeling.
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