Journal ArticleDOI
High-cycle fatigue life prediction for Pb-free BGA under random vibration loading
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TLDR
An assessment methodology based on vibration tests and finite element analysis (FEA) to predict the fatigue life of electronic components under random vibration loading and the calculated fatigue life based on the rainflow cycle counting results, the S–N curve, and the modified Miner’s rule agreed with actual testing results.About:
This article is published in Microelectronics Reliability.The article was published on 2011-03-01. It has received 117 citations till now. The article focuses on the topics: Vibration fatigue & Random vibration.read more
Citations
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Journal ArticleDOI
Random vibration reliability of BGA lead-free solder joint
Fang Liu,Guang Meng +1 more
TL;DR: The results show that the failure mechanisms of BGA lead-free solder joint vary as the acceleration PSD amplitude increases, which is a concern in microelectronic industry.
Journal ArticleDOI
Numerical simulation and fatigue life estimation of BGA packages under random vibration loading
TL;DR: It is concluded that solder joints at the four outermost corners of BGA packages have higher peeling stress values than others, especially at the both sides of solder joints near PCB and BGA.
Journal ArticleDOI
Fatigue life prediction of Package-on-Package stacking assembly under random vibration loading
TL;DR: Results show that simulated fatigue life matches well with the random vibration test results, which implies that this approach could be a potential method for the predication of fatigue life of the 3D packaging under random vibration.
Journal ArticleDOI
PBGA packaging reliability assessments under random vibrations for space applications
Yeong K. Kim,Do Soon Hwang +1 more
TL;DR: Experimental and numerical analyses on the solder joint reliability of plastic ball grid array under harsh random vibration and thermal loadings showed the robustness of the packaging structure for potential space applications.
Journal ArticleDOI
Comparison of Electronic Component Durability Under Uniaxial and Multiaxial Random Vibrations
TL;DR: In this article, an electrodynamic shaker capable of controlled vibration in six degrees of freedom (DOF) was employed for the experiments and the average damage accumulation rate (DAR) in the inductor leads was measured for random excitations in-plane, out-of-plane and both directions simultaneously.
References
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Book
Vibration analysis for electronic equipment
TL;DR: Vibrations of simple electronic systems lumped masses for electronic assemblies beam structures for electronic subassemblies electronic components, frames, and rings printed-circuit boards and flat plates preventing sinusoidal vibration failures understanding random vibration designing for shock environments designing electronic boxes vibration fixtures and vibration testing fatigue in electronic structures as mentioned in this paper.
Proceedings Article
Microelectronics reliability
TL;DR: In this article, the importance of the involvement of the design and manufacturing team in achieving reliability of microelectronic devices is highlighted. And a method of verifying reliability goals through calculation of failure rates based on life test parameters is described.
Journal ArticleDOI
Effects of Ag content on fracture resistance of Sn-Ag-Cu lead-free solders under high-strain rate conditions
Daewoong Suh,Dong W. Kim,Pilin Liu,Hyunchul Kim,Jessica A. Weninger,Chetan M. Kumar,Aparna Prasad,Brian W. Grimsley,Hazel B. Tejada +8 more
TL;DR: In this article, the effects of Ag content on fracture resistance of solders under high-strain rate conditions are examined in an attempt to optimize bulk properties for enhanced drop performance.
Proceedings ArticleDOI
Drop Shock Reliability of Lead-Free Alloys - Effect of Micro-Additives
TL;DR: In this article, a broad range of base alloy compositions together with selected micro-alloying additions to SnAgCu alloys have been evaluated with the objective of controlling bulk alloy mechanical properties and the diffusion processes operating in the formation and growth of the intermetallic interfacial layer(s).
Related Papers (5)
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