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The proposed cross-fin heat sink provides a practical alternative to the widely adopted plate-fin heat sinks.
We conclude that thermal aware transistor design can suppress self-heating without compromising performance and electrostatic control of the transistor.
The predicted thermal resistance of the heat sink agrees well with those obtained from experiments. This study illustrates the utility of numerical experiments in the design and optimization of heat sinks.
The investigation indicates that for heat sink bases with a high effective thermal conductivity, such as the base embedded with a typical heat pipe, the entire heat sink can be modeled as a flat plate with a uniform temperature and an effective convection heat transfer coefficient.
It is also shown that the spreading resistance encountered when heat flows from a heat source to the base plate of a heat sink, while significant, can be compensated for by making appropriate design modifications to the heat sink.
A synthetic jet-heat sink combination exhibits an identical thermal performance with that obtained with a conventional fan-heat sink mechanism.
We show also that the radius of the cylindrical SG drastically changes the temperature and heat flux distributions within the transistor devices.
The results showed that there exists sufficient scope to optimize the thermal design of the heat sink.
The results of this study show that the base temperature along with the thermal resistance of the heat sink is lower for the proposed design.

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