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Similarly to the operation of a conventional double-gate silicon FET, the top-gate bias modulates the threshold voltage of the bottom-gate transistor and significantly improves the transistor sub-threshold swing and leakage current.
However, a careful investigation both at the transistor and circuit level, reveals that the BC FET is better than the SCI FET for moderate speed, ultra low-power applications.
Journal ArticleDOI
John M. Shannon, Ed Gerstner 
86 Citations
The authors introduce a source-gated transistor that overcomes some of the fundamental limitations of the field-effect transistor.
A functional MOS transistor is proposed which works more intelligently than a mere switching device.
The output and transfer characteristics of the fabricated FET show a behavior that is consistent with the minimum channel width of the device.
Analysis and simulation demonstrates that the FET gate voltage to drain current transfer characteristic has a significant detrimental effect on these characteristics, indicating it is the major factor in the difference between ideal and practical results.
A novel one‐dimensional electron gas field‐effect transistor (FET) is proposed with the advantages of higher electron mobility and higher carrier concentration than conventional two‐dimensional electron gas FET.
It can be concluded that multi-Si nanowire FET reveals much larger on-current than that of conventional planar FET.
Compared with the field-effect transistor, a source-gated transistor more nearly meets these requirements.
We propose a novel ferroelectric-gate field-effect transistor (FET) with a polar semiconductor channel, which is called a controlled-polarization-type ferroelectric-gate FET.
In principle, a memory field-effect transistor (FET) based on the metal-ferroelectric-semiconductor gate stack could be the building block of an ideal memory technology that offers random access, high speed, low power, high density and nonvolatility.
The narrower gate width device provides the best performance for the n-type field-effect transistor (n-FET) with the same gate length.
The observed technical performance parameters (drain and transfer characteristics) have similarity with technical conventional characteristics (parameter-wise) of semiconductor FET device, the transistor.
These results demonstrate that the vertical FET operates as a static induction transistor and the short length between the source, drain and gate electrodes in the device structure improves the device characteristics.
The FET exhibited high performances with one of the highest hole mobilities (0.68 cm2 V(-1) s(-1)) for thin-film transistors and a high on/off ratio, implying a promising material in the FET family.
Therefore, the HEMT is a more suitable transducer platform than the conventional silicon-based transistor.
Electrical measurements show that the device has characteristics of a typical FET device.