抗原变异可使得多种致病微生物易于逃避宿主免疫应答。表达在感染红细胞表面的恶性疟原虫红细胞表面蛋白1（PfPMP1）与感染红细胞、内皮细胞、树突状细胞以及胎盘的单个或多个受体作用，在黏附及免疫逃避中起关键的作用。每个单倍体基因组var基因家族编码约60种成员，通过启动转录不同的var基因变异体为抗原变异提供了分子基础。

疟原虫var基因转换速率变化导致抗原变异[英]／Paul H, Robert P, Christodoulou Z, et al//Proc Natl Acad Sci U S A

Deposits of clastic carbonate-dominated (calciclastic) sedimentary slope systems in the rock record have been identified mostly as linearly-consistent carbonate apron deposits, even though most ancient clastic carbonate slope deposits fit the submarine fan systems better. Calciclastic submarine fans are consequently rarely described and are poorly understood. Subsequently, very little is known especially in mud-dominated calciclastic submarine fan systems. Presented in this study are a sedimentological core and petrographic characterisation of samples from eleven boreholes from the Lower Carboniferous of Bowland Basin (Northwest England) that reveals a >250 m thick calciturbidite complex deposited in a calciclastic submarine fan setting. Seven facies are recognised from core and thin section characterisation and are grouped into three carbonate turbidite sequences. They include: 1) Calciturbidites, comprising mostly of highto low-density, wavy-laminated bioclast-rich facies; 2) low-density densite mudstones which are characterised by planar laminated and unlaminated muddominated facies; and 3) Calcidebrites which are muddy or hyper-concentrated debrisflow deposits occurring as poorly-sorted, chaotic, mud-supported floatstones. These

Phd by thesis

Li-ion batteries have transformed portable electronics and will play a key role in the electrification of transport. However, the highest energy storage possible for Li-ion batteries is insufficient for the long-term needs of society, for example, extended-range electric vehicles. To go beyond the horizon of Li-ion batteries is a formidable challenge; there are few options. Here we consider two: Li-air (O(2)) and Li-S. The energy that can be stored in Li-air (based on aqueous or non-aqueous electrolytes) and Li-S cells is compared with Li-ion; the operation of the cells is discussed, as are the significant hurdles that will have to be overcome if such batteries are to succeed. Fundamental scientific advances in understanding the reactions occurring in the cells as well as new materials are key to overcoming these obstacles. The potential benefits of Li-air and Li-S justify the continued research effort that will be needed.

Li-O2 and Li-S batteries with high energy storage.

Microstructures and properties of high-entropy alloys

Energy-storage technologies, including electrical double-layer capacitors and rechargeable batteries, have attracted significant attention for applications in portable electronic devices, electric vehicles, bulk electricity storage at power stations, and “load leveling” of renewable sources, such as solar energy and wind power. Transforming lithium batteries and electric double-layer capacitors requires a step change in the science underpinning these devices, including the discovery of new materials, new electrochemistry, and an increased understanding of the processes on which the devices depend. The Review will consider some of the current scientific issues underpinning lithium batteries and electric double-layer capacitors.

Challenges Facing Lithium Batteries and Electrical Double‐Layer Capacitors

When interconnect feature sizes (e.g., widths) and grain sizes are comparable, their average electromigration-lifetime increases. However, reliability increase occurs for a population of lines only if microstructural weak links, such as polygranular clusters, become unlikely throughout the population. Lifetime statistics and grain structure statistics are linked in a way which must be understood in order to take advantage of lifetime improvements through line-width-dependent and line-length-dependent current density limits. An analytic model has been developed which allows calculation of the polygranular cluster length distribution as a function of line width, line length and current density, given continuous-film median grain sizes and grain size deviations. A simple analytic model for the effect of post-patterning anneals on polygranular cluster length distributions is also presented. These models are shown to be consistent with detailed computer simulations of grain structures and grain structure evolution in interconnects. Improved grain structure models will enable less-conservative integrated circuit design practice, allowing design of higher performance circuits.

Modeling of the Structure and Reliability of Near-Bamboo Interconnects

A new side reservoir test structure is shown to have improved electromigration reliability over conventional end-of-line reservoir structures. This is believed to be due to the ability of the side reservoir to “trap” migrating pre-existing voids before they reach the cathode end. The ability of the side reservoir to ‘trap’ pre-existing voids is believed to be associated with local differences in back-stresses and with the differing adhesion strength of Cu atoms with the Ta/Cu and SiN-SiCN/Cu interfaces.

Effects of side reservoirs on the electromigration lifetime of copper interconnects

Orientation selective grain growth in thin films arises due to anisotropy in materials properties. For continuous thin films, there are at least two orientation dependent driving forces for grain growth: (i) surface and interface energy anisotropy; (ii) strain energy anisotropy (both elastic and plastic). In fcc metals, the preferred growth of grains with (111) texture occurs due to their low surface and interface energy. Stresses in thin films arise during deposition and as a result of post-deposition annealing. A texture dependence of strain energy density arises in biaxially strained thin films due to anisotropy of elastic properties and/or orientation-dependent yield stresses. For most fcc metals, the strain energy driving force promotes the growth of (001) grains due to minimization of the combined elastic and plastic strain energy. The magnitudes of the orientation dependent driving forces for grain growth depend on the characteristics and processing conditions of the film and substrate. We have performed grain growth experiments for Ag films on single crystal Ni on MgO; Ag films on plasma-enhanced chemical vapor deposited (PECVD) SiO2 on MgO; Ag films on oxidized Si; and Ni films on oxidized Si. The texture resulting from grain growth in films of different thicknesses and deposited at different temperatures were determined, and the results are presented in the form of texture maps. The texture which dominates as a result of grain growth can be understood through the use of texture maps and compares well with analytic models for texture development during grain growth in thin films.

Texture Maps for Orientation Evolution During Grain Growth in Thin Films

We have detected magnetic transitions in Ni/Cu (100) films as a function of Ni thickness through in situ measurements of the magneto-optic Kerr effect (MOKE). Crystalline quality was monitored using in situ RHEED and Auger electron spectroscopy. Films were deposited by molecular beam epitaxy on silicon wafers and cleaved sodium chloride with varying epitaxial Ni layer thicknesses between 10 and 200 A. High-resolution TEM images of these films indicate decreasing misfit dislocation spacing and decreasing strain as measured by moire fringe analysis with increasing Ni thickness. These observations have been correlated with changes in magnetic anisotropy as measured by MOKE. MOKE, therefore, may provide a tool for in situ monitoring of the kinetics of misfit accommodation in magnetic thin films.

https://www.cambridge.org/core/services/aop-cambridge-core/content/view/S1946427400321534

Carl V. Thompson

Papers

Modeling of the Structure and Reliability of Near-Bamboo Interconnects

Effects of side reservoirs on the electromigration lifetime of copper interconnects

Texture Maps for Orientation Evolution During Grain Growth in Thin Films

Use of Magneto-Optic Kerr Effect Measurements to Study Strain and Misfit Accommodation in Thin Films of Ni/Cu (100)

Comment on: Compressive stress in polycrystalline volmer-weber films. Authors' reply