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Carl V. Thompson
Researcher at Massachusetts Institute of Technology
Publications - 422
Citations - 22680
Carl V. Thompson is an academic researcher from Massachusetts Institute of Technology. The author has contributed to research in topics: Thin film & Grain growth. The author has an hindex of 77, co-authored 416 publications receiving 21156 citations. Previous affiliations of Carl V. Thompson include Max Planck Society & Harvard University.
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Journal ArticleDOI
Effects of microstructure on the formation, shape, and motion of voids during electromigration in passivated copper interconnects
TL;DR: In this paper, postmortem electron backscattered diffraction (EBSD) analysis was performed after in situ testing, and a correlation of EBSD data with the in situ observations reveals that locations at which voids form, their shape evolution, and their motion all strongly depend on the locations of grain boundaries and the crystallographic orientations of neighboring grains.
Journal ArticleDOI
Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits
Riko I Made,Riko I Made,Riko I Made,Chee Lip Gan,Chee Lip Gan,Li Ling Yan,Katherine Hwee Boon Kor,Hong Ling Chia,Kin Leong Pey,Kin Leong Pey,Carl V. Thompson,Carl V. Thompson +11 more
TL;DR: In this article, an analytical model is proposed which relates the bonding temperature, pressure and duration with the integrity of metal-metal thermocompression bonds, taking into account the pressure-dependent time evolution of the thermoco-compression bond formation.
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Compositional dependence of Young’s moduli for amorphous Cu–Zr films measured using combinatorial deposition on microscale cantilever arrays
Qiang Guo,Qiang Guo,Qiang Guo,Li Zhang,Li Zhang,Adam S. Zeiger,Yat Li,Yat Li,Krystyn J. Van Vliet,Carl V. Thompson,Carl V. Thompson +10 more
TL;DR: Young's moduli of amorphous Cu-Zr thin films have been determined with unprecedented compositional resolution, via combinatorial film deposition and force-deflection measurements of microscale cantilevers.
Proceedings ArticleDOI
Modeling and experimental characterization of electromigration in interconnect trees
TL;DR: In this article, the authors extended the understanding of "immortality" demonstrated and analyzed for straight stud-to-stud lines, to trees of arbitrary complexity, and developed simulation tools that allow modeling of stress evolution and failure in arbitrarily complex trees.
Journal ArticleDOI
Porosimetry and packing morphology of vertically aligned carbon nanotube arrays via impedance spectroscopy.
Heena K Mutha,Yuan Lu,Itai Y. Stein,H. Jeremy Cho,Matthew E. Suss,Tahar Laoui,Carl V. Thompson,Brian L. Wardle,Evelyn N. Wang +8 more
TL;DR: The results suggest that waviness of CNTs leads to variations in the inter-CNT spacing, which can be significant in sparse carpets, and this methodology can be used to predict the performance of many nanostructured devices, including supercapacitors, batteries, solar cells, and semiconductor electronics.