Carl V. Thompson

TL;DR: In this paper, the authors investigated the deviation in the time to failure (DTTF) in lines with bimodal structures and found that lines with large grain structures have higher DTTF than lines with small grain structures.

TL;DR: In this article, pull-off measurements were used to characterize the tensile toughness of bonds between Cu layers deposited, pressure bonded, and tested under ultrahigh vacuum (<2×10−10Torr).

TL;DR: The application of differential scanning calorimetry to the study of reactions in thin films is illustrated through a number of examples: the epitaxial regrowth of ion-implanted amorphous silicon, the formation of ammorphous metals by solid-state reaction, formation of intermetallic compounds in a mettalic multilayer, the transformations in nickel/amorphous silicon multilayers, and the identification of microcrystalline structures by the observation of grain growth as discussed by the authors.

TL;DR: In this article, the authors report a new experimental technique for the study of electromigration in Al lines containing controlled, single, identical grain boundaries with boundary planes perpendicular to the plane of the substrates.

TL;DR: In this paper, the authors investigated the crystallization of GeTe films as a function of their deposition temperatures and deposition rates, using X-ray synchrotron radiation and Raman spectroscopy.