P
Paul S. Ho
Researcher at University of Texas at Austin
Publications - 481
Citations - 14016
Paul S. Ho is an academic researcher from University of Texas at Austin. The author has contributed to research in topics: Electromigration & Dielectric. The author has an hindex of 60, co-authored 475 publications receiving 13444 citations. Previous affiliations of Paul S. Ho include National Institute of Standards and Technology & IBM.
Papers
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Journal ArticleDOI
Stoichiometric and structural origin of electronic states at the Pd2Si-Si interface
Paul S. Ho,P. E. Schmid,H. Foll +2 more
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Auger study of preferred sputtering on Ag–Au alloy surfaces
TL;DR: In this article, the preferred sputtering behavior on homogeneous Ag-Au alloy surfaces was investigated by using an Auger electron spectroscopy (AES) to determine the individual sputter yields for Ag and Au atoms in the alloy.
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Pressure Dependence of the Elastic Constants for Aluminum from 77° to 300°K
Paul S. Ho,Arthur L. Ruoff +1 more
TL;DR: In this article, the isothermal elastic constants are obtained as a function of pressure by a self-consistent analysis of the ultrasonic data, and the most probable values for the pressure derivatives are calculated from the results of six measurements of different combinations of the elastic constants.
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Statistical analysis of early failures in electromigration
TL;DR: In this paper, a technique utilizing large interconnect arrays in conjunction with the well-known Wheatstone bridge is presented for the detection of early failures in electromigration (EM) and the complicated statistical nature of this important reliability phenomenon have been difficult issues to treat in the past.
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Direct observation of a critical length effect in dual-damascene Cu/oxide interconnects
Ennis T. Ogawa,Alexander J. Bierwag,Ki Don Lee,Hideki Matsuhashi,Patrick R. Justison,A. N. Ramamurthi,Paul S. Ho,V. Blaschke,David Griffiths,Anne Nelsen,Mark R. Breen,Robert H. Havemann +11 more
TL;DR: In this paper, a Blech-type line element ensemble was used for failure analysis of dual-damascene, Cu/oxide, multilinked interconnects.