R
Runsheng Wang
Researcher at Peking University
Publications - 268
Citations - 2578
Runsheng Wang is an academic researcher from Peking University. The author has contributed to research in topics: Computer science & MOSFET. The author has an hindex of 23, co-authored 217 publications receiving 1940 citations.
Papers
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Journal ArticleDOI
TD-SRAM: Time-Domain-Based In-Memory Computing Macro for Binary Neural Networks
Jiahao Song,Yuan Wang,Minguang Guo,Xiang Ji,Kaili Cheng,Yixuan Hu,Xiyuan Tang,Runsheng Wang,Ru Huang +8 more
TL;DR: In this paper, a dual-edge single input (DESI) TD computing topology is proposed, which can significantly improve the area and power efficiencies of TD cell and support binary DNNs.
Journal ArticleDOI
Investigation on the Lateral Trap Distributions in Nanoscale MOSFETs During Hot Carrier Stress
TL;DR: In this article, the lateral trap distributions in planar and FinFET devices were experimentally studied under various bias stress conditions of hot-carrier degradation (HCD), and it was found that the peak of the trap distribution profile will gradually move closer to the source region with the increase in the HCD stress.
Proceedings ArticleDOI
New observations on complex RTN in scaled high-κ/metal-gate MOSFETs — The role of defect coupling under DC/AC condition
Pengpeng Ren,Peng Hao,Changze Liu,Runsheng Wang,Xiaobo Jiang,Yingxin Qiu,Ru Huang,Shaofeng Guo,Mulong Luo,Jibin Zou,Meng Li,Jianping Wang,Jingang Wu,Jinhua Liu,Weihai Bu,Waisum Wong,Scott Yu,Hanming Wu,Shiuh-Wuu Lee,Yangyuan Wang +19 more
TL;DR: In this article, the defect coupling effect between multi-traps in complex RTN was experimentally studied in scaled high-κ/metal-gate MOSFETs for the first time.
Journal ArticleDOI
Hot Carrier Degradation-Induced Dynamic Variability in FinFETs: Experiments and Modeling
TL;DR: In this paper, the dynamic variability induced by hot carrier degradation (HCD) in FinFETs with decomposing the variation contributions of multiple types of traps is studied with a circuit simulation.
Journal ArticleDOI
Probing and Manipulating the Interfacial Defects of InGaAs Dual‐Layer Metal Oxides at the Atomic Scale
Xing Wu,Xing Wu,Chen Luo,Peng Hao,Tao Sun,Runsheng Wang,Chaolun Wang,Zhigao Hu,Yawei Li,Jian Zhang,G. Bersuker,Litao Sun,K. L. Pey +12 more
TL;DR: This study unearths the fundamental defect-driven interfacial electric structure of III-V semiconductor materials and paves the way to future high-speed and high-reliability devices.