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W. Graham

Researcher at IBM

Publications -  25
Citations -  980

W. Graham is an academic researcher from IBM. The author has contributed to research in topics: Polyimide & Layer (electronics). The author has an hindex of 11, co-authored 25 publications receiving 953 citations.

Papers
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Journal ArticleDOI

High-speed signal propagation on lossy transmission lines

TL;DR: The paper addresses the problems found on lossy lines, such as reflections, rise-time slowdown, increased delay, attenuation, and crosstalk, and suggests methods for controlling these effects in order to maintain distortion-free propagation of high-speed signals.
Journal ArticleDOI

A Practical Implementation of Silicon Microchannel Coolers for High Power Chips

TL;DR: In this paper, the authors describe a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors, which is able to cool chips with average power densities of 400W/cm2 or more.
Proceedings ArticleDOI

A practical implementation of silicon microchannel coolers for high power chips

TL;DR: In this article, the authors describe a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors, achieving a unit thermal resistance of 10.5 C-mm/sup 2/W from the cooler surface to the inlet water with a fluid pressure drop of less than 35 kPa.
Patent

Nano/Microwire Solar Cell Fabricated by Nano/Microsphere Lithography

TL;DR: In this paper, a method for fabricating a solar cell is described, which includes the following steps: a monolayer of spheres is deposited onto the substrate. The spheres include nanospheres, microspheres or a combination thereof. The trimmed spheres are used as a mask to pattern wires in the substrate, and a doped emitter layer is formed on the patterned wires.
Journal ArticleDOI

Electroless Deposition of Cu on Glass and Patterning with Microcontact Printing

TL;DR: In this paper, the authors used microcontact printing to pattern a metal onto 15 × 15 sq-inch glass substrates by self-assembly of a thin layer of amino-derivatized silanes to the glass, binding Pd/Sn catalytic particles to the silanes, electroless deposition of ∼120 nm of Cu on the catalytic surface, and selectively etching the printed Cu using hexadecanethiol as a resist.