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Proceedings ArticleDOI

A Semiconductor Area Based Assessment of AC Motor Drive Converter Topologies

Thomas Friedli, +1 more
- pp 336-342
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TLDR
In this paper, a new semiconductor chip area-based approach is proposed to compare and assess different motor drive converter topologies, based on the drive's operating point and the optimal partitioning of the transistor and diode chip areas.
Abstract
In order to find the optimal converter topology for a given ac motor drive, as defined by its mission profile, suitable assessment criteria have to be applied. A new semiconductor chip area based approach is proposed to compare and assess different motor drive converter topologies. It determines the total semi-conductor chip area based on the drive's operating point and the optimal partitioning of the transistor and diode chip areas. This approach not only provides a distinct figure-of-merit for comparison but also enables the semiconductor costs of different converter topologies to be determined. The chip area based comparison has been successfully used to assess three 3-phase ac-dc-ac converter topologies for a 15 kW (20 HP) motor drive. It is shown that the Voltage DC-Link Back-to-Back Converter based drive provides the best overall performance in terms of chip area, cost, efficiency, and available nominal torque.

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Citations
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Journal ArticleDOI

SiC versus Si—Evaluation of Potentials for Performance Improvement of Inverter and DC–DC Converter Systems by SiC Power Semiconductors

TL;DR: The impact on the system-level performance, i.e., efficiency, power density, etc., of industrial inverter drives and of dc-dc converter resulting from the new SiC devices is evaluated based on analytical optimization procedures and prototype systems.
Journal ArticleDOI

Review of Three-Phase PWM AC–AC Converter Topologies

TL;DR: This paper presents first an overview of the well-known voltage and current dc-link converter topologies used to implement a three-phase PWM ac-ac converter system, and a common knowledge basis of the individual converterTopologies is established.
Journal ArticleDOI

Comparative Evaluation of Advanced Three-Phase Three-Level Inverter/Converter Topologies Against Two-Level Systems

TL;DR: A holistic comparison of advanced three-level topologies against the standard two-level voltage-source converter is given and shows the benefits and the optimization potential concerning several aspects, such as the necessary semiconductor chip area, the harmonic losses in the load machine and in filter components, and the volume of passive components.
Journal ArticleDOI

Comparative Evaluation of Three-Phase AC–AC Matrix Converter and Voltage DC-Link Back-to-Back Converter Systems

TL;DR: This paper introduces the methodology and the results of a comprehensive comparison of a direct matrix converter, an indirect MC, and a voltage dc-link back-to-back converter for a 15-kW permanent magnet synchronous motor drive.
Journal ArticleDOI

Optimal Design of LCL Harmonic Filters for Three-Phase PFC Rectifiers

TL;DR: In this paper, a design procedure for the mains side LCL filter of an active three-phase rectifier is introduced, based on a generic optimization approach, which guarantees a low volume and/or low losses.
References
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Novel Three-Phase AC–AC Sparse Matrix Converters

TL;DR: In this article, a three-phase ac-ac sparse matrix converter with no energy storage elements and employing only 15 IGBTs, as opposed to 18 IGBT switches, was proposed.
Proceedings ArticleDOI

Semiconductor losses in voltage source and current source IGBT converters based on analytical derivation

TL;DR: In this article, a complete analytical calculation of the power semiconductor losses for both converter types is presented, most parts are already known, some parts are developed here, as far as the authors know.
Journal ArticleDOI

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Journal Article

A Dynamic Electro-Thermal Model for the IGBT | NIST

TL;DR: In this article, a physics-based dynamic electrothermal model is developed for the insulated-gate bipolar transistor (IGBT) by coupling a temperature-dependent IGBT electrical model with dynamic thermal models for the IGBT silicon chip, packages, and heatsinks.
Proceedings ArticleDOI

A dynamic electro-thermal model for the IGBT

A.R. Hefner
TL;DR: In this paper, a physics-based dynamic electrothermal model is developed for the IGBT by coupling a temperature-dependent IGBT electrical model with dynamic thermal models for IGBT silicon chip, packages, and heatsinks.
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