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Journal ArticleDOI

A surface micromachined electrostatic ultrasonic air transducer

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TLDR
In this article, an electrical equivalent circuit model for electrostatic transducers based on the early work of Mason (1942) was designed and constructed for operation at 1.8 and 4.6 MHz.
Abstract
Airborne ultrasound has many applications such as, ranging, nondestructive evaluation, gas flow measurement, and acoustic microscopy. This paper investigates the generation and detection of ultrasound in air at a few MHz. Conventional plane piston lead zirconium titanate (PZT) based transducers perform poorly for this application due to the lack of proper matching layer materials. Electrostatic, or capacitive, transducers promise higher efficiency and broader bandwidth performance. The device structure in this work consists of a capacitor where one plate is a circular silicon nitride membrane coated with gold and the other is a rigid silicon substrate. By applying a voltage between the membrane and the silicon substrate, an electrostatic force is exerted on the membrane which sets it in motion, thus generating a sound wave in air. Presented here is an electrical equivalent circuit model for electrostatic transducers which is based on the early work of Mason (1942). The electrostatic transducers were designed and constructed for operation at 1.8 and 4.6 MHz. The transducers were fabricated using standard micromachining techniques. An optical interferometer was used to measure the peak displacement of the 1.8 MHz electrostatic transducer at 230 /spl Aring//V. A transmit-receive system was built using two electrostatic transducers. The system had a signal to noise ratio of 34 dB at a transducer separation of 1 cm. Each transducer had a 3-dB bandwidth of 20%, and a one-way insertion loss of 26 dB. There is excellent agreement between the measured device performance and theoretical predictions.

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Citations
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Journal ArticleDOI

Surface micromachined capacitive ultrasonic transducers

TL;DR: A theoretical model is proposed that agrees well with observed transducer behavior and is used to demonstrate that microfabricated ultrasonic transducers constitute an attractive alternative to piezoelectric transducers in many applications.
Journal ArticleDOI

Capacitive micromachined ultrasonic transducers: next-generation arrays for acoustic imaging?

TL;DR: The first pulse-echo phased array B-scan sector images using a 128-element, one-dimensional (1-D) linear CMUT array is presented and preliminary investigations on the effects of crosstalk among array elements on the image quality are performed.
Journal ArticleDOI

Fabricating capacitive micromachined ultrasonic transducers with wafer-bonding technology

TL;DR: In this paper, a new method for fabricating capacitive micromachined ultrasonic transducers (CMUTs) that uses a wafer bonding technique is introduced. But the method is not suitable for large CMUTs.
Journal ArticleDOI

Capacitive micromachined ultrasonic transducers for medical imaging and therapy

TL;DR: The presented results prove the CMUT as a MEMS technology for many medical diagnostic and therapeutic applications as well as the progression of developing several generations of fabrication processes.
Journal ArticleDOI

High-Temperature Piezoelectric Sensing

TL;DR: An overview of high-temperature piezoelectric sensing techniques including accelerometer, surface acoustic wave sensor, ultrasound transducer, acoustic emission sensor, gas sensor, and pressure sensor for temperatures up to 1,250 °C are presented.
References
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Journal Article

Silicon as a mechanical material

TL;DR: In this article, the advantages of employing silicon as a mechanical material, the relevant mechanical characteristics of silicon, and the processing techniques which are specific to micromechanical structures are discussed.
Journal ArticleDOI

Surface micromachined pressure transducers

TL;DR: In this paper, an absolute pressure transducers with four diaphragms, two active and two inactive, have been constructed and optimized towards manufacturability, and the measured performance is excellent and agrees with the predictions of the design algorithm.
Journal ArticleDOI

Fabrication of silicon condenser microphones using single wafer technology

TL;DR: In this article, a condenser microphone design that can be fabricated using the sacrificial layer technique is proposed and tested using a 1 mu m plasma-enhanced chemical-vapor-deposited (PECVD) silicon nitride film with a high density of acoustic holes (120-525 holes/mm/sup 2/), covered with a thin Ti/Au electrode.
Journal ArticleDOI

The performance of capacitive ultrasonic transducers using v-grooved backplates

TL;DR: In this paper, the authors describe the performance of capacitive transducers constructed with v-groove backplates and membranes of varying thicknesses, and give design criteria for producing transducers at well defined frequencies.
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