Journal ArticleDOI
Convective Immersion Cooling of Parallel Vertical Plates
A. Bar-Cohen,H. Schweitzer +1 more
TLDR
In this paper, the authors provide an analytical basis for the design and optimization of convective immersion cooling systems by focusing on the analytical development and experimental verification of composite relations for the natural convection heat transfer coefficients prevailing along the Surfaces of immersed, uniformly heated plates in both symmetric and asymmetric configurations.Abstract:
Complete immersion of electronic assemblies, in fluids of appropriately high dielectric strength and low dielectric constant, offers a most promising alternative to conventional thermal control measures. The present study is aimed at providing an analytical basis for the design and optimization of convective immersion cooling systems by focusing on the analytical development and experimental verification of composite relations for the natural convection heat transfer coefficients prevailing along the Surfaces of immersed, uniformly heated plates in both symmetric and asymmetric configurations.read more
Citations
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Journal ArticleDOI
Enhanced immersion cooling using two-tier micro- and nano-structures
TL;DR: In this article, a Si nanowire array, Si micropillar (SiMP) array, and si nanowires on a Si micro-drone two-tier structure were employed to enhance boiling performance.
Journal ArticleDOI
Infrared techniques for natural convection investigations in channels between two vertical, parallel, isothermal and symmetrically heated plates
TL;DR: In this article, the effect of gap width between two symmetrically heated vertical, parallel, isothermal plates on intensity of natural convective heat transfer in a gas was experimentally studied using the balance and gradient methods.
Journal ArticleDOI
Passive Immersion Cooling of 3-D Stacked Dies
TL;DR: In this paper, a methodology for the optimization of immersion cooled 3-D stacked dies is presented, including the effects of confinement on natural convection and channel boiling, and the optimal die spacings for both single and two phase cooling with saturated FC-72 are found to be on the order of half a millimeter for typical microelectronics geometries.
Pool and flow boiling in narrow gaps - application to 3d chip stacks
Avram Bar-Cohen,E. Rahim +1 more
Journal ArticleDOI
Transient model for the development of an air-cooled LiBr-H2O absorption chiller based on heat and mass transfer empirical correlations
TL;DR: In this paper, the authors describe transient numerical modeling of a direct air-cooled, single-effect absorption chiller, which is lumped parametric based on transient mass, momentum, and energy balances.
References
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Journal ArticleDOI
A general expression for the correlation of rates of transfer and other phenomena
Stuart W. Churchill,R. Usagi +1 more
TL;DR: The expression Y = (1 + Zn)1/n where Y and Z are expressed in terms of the solutions for asymptotically large and small values of the independent variable is shown to be remarkably successful in correlating rates of transfer for processes which vary uniformly between these limiting cases as discussed by the authors.
Journal ArticleDOI
Heat dissipation of parallel plates by free convection
TL;DR: In this article, the warmeabgabe bei freier Konvektion in Luft von vertikalen quadratischen parallelen Platten of h × h cm2 im gegenseitigen Abstand b wird gemessen.
Thermally optimum spacing of vertical, natural convection cooled, parallel plates
TL;DR: In this article, the authors developed composite relations for the variation of the heat transfer coefficient along the plate surfaces, and the mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of the presentation.
Journal ArticleDOI
Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates
TL;DR: In this paper, the authors developed composite relations for the variation of the heat transfer coefficient along the plate surfaces, and the mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of the presentation.
Book
Thermal Analysis and Control of Electronic Equipment
Allan D. Kraus,Avram Bar-Cohen +1 more
TL;DR: In this article, thermal analysis and control of electronic equipment, thermal analysis of electronic devices and their control, thermal control and control in the field of software engineering, is discussed. ǫ