Journal ArticleDOI
Convective Immersion Cooling of Parallel Vertical Plates
A. Bar-Cohen,H. Schweitzer +1 more
TLDR
In this paper, the authors provide an analytical basis for the design and optimization of convective immersion cooling systems by focusing on the analytical development and experimental verification of composite relations for the natural convection heat transfer coefficients prevailing along the Surfaces of immersed, uniformly heated plates in both symmetric and asymmetric configurations.Abstract:
Complete immersion of electronic assemblies, in fluids of appropriately high dielectric strength and low dielectric constant, offers a most promising alternative to conventional thermal control measures. The present study is aimed at providing an analytical basis for the design and optimization of convective immersion cooling systems by focusing on the analytical development and experimental verification of composite relations for the natural convection heat transfer coefficients prevailing along the Surfaces of immersed, uniformly heated plates in both symmetric and asymmetric configurations.read more
Citations
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Patent
Gas-liquid forced turbulence cooling
TL;DR: A cooling system employs a cooling liquid and a cooling gas in a combined thermodynamic cycle to overcome the flow resistance of dense assemblies of heat generating components and to improve heat transfer by inducing turbulence, thereby reducing the effects of thermal hysteresis and boundary layer formation as mentioned in this paper.
Proceedings ArticleDOI
Thermal management of on-chip hot spots and 3D chip stacks
TL;DR: In this paper, the authors present a discussion of the research challenges associated with the commercial implementation of on-chip thermoelectric coolers and direct liquid cooling in dielectric liquids.
Thermosyphon boiling in vertical channels
Avram Bar-Cohen,H. Schweitzer +1 more
TL;DR: In this article, a model analytique et experimentale du transfert de chaleur par ebullition dans l'eau sur une paire de plaques plates, a flux thermiques egaux.
Journal ArticleDOI
Bibliography of Heat Transfer in Electronic Equipment
V. Antonetti,R. Simons +1 more
TL;DR: A bibliography of 237 publications dealing with heat transfer in electronic equipment is presented in this paper, covering the period from 1970-1984, although a majority of the papers listed were published in the last three years.
References
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Journal ArticleDOI
Developing laminar free convection between vertical flat plates with asymmetric heating
TL;DR: In this paper, a numerical and experimental investigation of the developing laminar free convection heat transfer in vertical parallel plate channels with asymmetric heating is presented, where the Nusselt number characterizing the total heat transfer to the fluid is found to be related to the Rayleigh number very nearly by a universal curve for all ratios of wall temperature differences.
Journal ArticleDOI
The Development of Free Convection Between Heated Vertical Plates
J. R. Bodoia,J. F. Osterle +1 more
TL;DR: The development of free convection in a viscous fluid between heated vertical plates is investigated in this paper, where the basic governing continuity, momentums and energy equations are expressed in finite difference form and solved numerically on a digital computer.
Journal ArticleDOI
Fully developed laminar free convection between vertical plates heated asymmetrically
Journal ArticleDOI
Pool Boiling Heat Transfer From Enhanced Surfaces to Dielectric Fluids
P. J. Marto,V. J. Lepere +1 more
TL;DR: In this article, the authors used a 15.8 mm o.d. plain copper tube and three copper enhanced surfaces: a Union Carbide High Flux surface, a Hitachi Thermoexcell-E surface and a Wieland Gewa-T surface.
Journal ArticleDOI
An Experimental Study of Turbulent Natural Convection Boundary Layers
G. C. Vliet,C. K. Liu +1 more
TL;DR: In this article, an experimental investigation on turbulent natural convection boundary layers has been conducted with water on a vertical plate of constant heat flux, with the emphasis on the turbulent regime.