Journal ArticleDOI
Deep dry etching of borosilicate glass using SF6 and SF6/Ar inductively coupled plasmas
TLDR
In this paper, deep reactive ion etching (DRIE) of borosilicate glass was carried out using SF 6 and SF 6/Ar plasmas in an inductively coupled plasma (ICP) reactor.About:
This article is published in Microelectronic Engineering.The article was published on 2005-10-01. It has received 133 citations till now. The article focuses on the topics: Plasma etching & Reactive-ion etching.read more
Citations
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Journal ArticleDOI
A practical guide for the fabrication of microfluidic devices using glass and silicon
TL;DR: The paper outlines techniques for forming electrical connections between microfluidic devices and external circuits and proposes a framework for the synthesis of a complete glass/silicon device fabrication flow.
Journal ArticleDOI
Dynamic contact angle effects onto the maximum drop impact spreading on solid surfaces
TL;DR: In this paper, a high speed video camera was used to follow in time the drop spreading, and it allows us to determine precisely the expansion of the drop and the profile of the free surface at the contact line.
Journal ArticleDOI
Microfluidic Model Porous Media: Fabrication and Applications.
TL;DR: In this Review, the materials and fabrication methods to make micromodels, the main research activities that are conducted with micromadels and their applications in petroleum, geologic, and environmental engineering, as well as in the food and wood industries, are discussed.
Journal ArticleDOI
Materials for microfabricated implantable devices: a review
Kee Scholten,Ellis Meng +1 more
TL;DR: The consequence of material choice as it pertains to microfabrication and biocompatibility is discussed in detail with a particular focus on the divide between hard, rigid materials and soft, pliable polymers.
Proceedings ArticleDOI
3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer
Michael Topper,Ivan Ndip,Robert Erxleben,Lars Brusberg,Nils F. Nissen,Henning Schröder,Hidefumi Yamamoto,Guido Todt,Herbert Reichl +8 more
TL;DR: In this article, the authors investigated the TGV for Through Glass Vias (TGV) for thin-film RDL and bumping of these wafers without any modifications to Si-wafer.
References
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Journal ArticleDOI
Micro Total Analysis Systems. 1. Introduction, Theory, and Technology
TL;DR: In this article, the authors present a review of the book.http://www.reviewreviews.com/reviews/book-reviews-of-the-book
Journal ArticleDOI
Micro total analysis systems. 2. Analytical standard operations and applications.
TL;DR: This second part of the review of microfluidic system preparation will cover a number of standard operations as well as some biological applications of micro total analysis systems.
Journal ArticleDOI
Micro total analysis systems. Recent developments.
Journal ArticleDOI
Microscopic uniformity in plasma etching
TL;DR: In this article, the authors review recent literature on microscopic uniformity in plasma etching and carefully define terminology to distinguish between aspect ratio dependent etching (ARDE) and the pattern dependent effect known as microloading, where the reactant concentration is depeleted as a result of an excessive substrate load.