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Proceedings ArticleDOI

Effect of the specimen size in predicting the mechanical properties of PbSn solder alloys

N.R. Bonda, +1 more
- Vol. 19, Iss: 2, pp 208-212
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TLDR
In this article, a single-phase solder alloy (98Pb-2Sn wt.%) deformed in both tension and cyclic loading was measured, and the number of grains required for a representative volume of the 98Pb2Sn alloy specimens tested is quite large.
Abstract
The data obtained from bulk test specimens are often used in deformation models to predict the mechanical responses of parts that are very different in size and shape, such as solder joints in VLSI surface mount components. Such predictions are valid only if the size of the solder joints exceeds the representative deformation volume of the bulk specimens. In the present study, the measurement of the representative volume was performed for a single-phase solder alloy (98Pb-2Sn wt.%) deformed in both tension and cyclic loading. Deformation of 98Pb-2Sn alloy at room temperature was shown to be extremely inhomogeneous in both tensile and cyclic loading, and strain localization was observed at the grain boundaries. Strain distribution is more inhomogeneous in the specimen tested in fatigue than the specimen tested in uniaxial tension. This may be due to fatigue inhomogeneity in strain distribution or a small degree of buckling. The number of grains required for a representative volume of the 98Pb-2Sn alloy specimens tested is quite large. >

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Citations
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Journal ArticleDOI

Influence of interfacial intermetallic compound on fracture behavior of solder joints

TL;DR: In this paper, the adhesive strength and shear strength of the solder joints of an as-soldered lead-free solder system with pure copper wires were investigated. And the authors determined how these characteristics, and the relationships between them, are influenced by the storage duration and the storage temperature.
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Measuring intrinsic elastic modulus of Pb/Sn solder alloys

TL;DR: In this article, the deformation kinetics of the Pb/Sn solder alloys are discussed at the grain size level, analytically, by single crystal elasticity and experimentally by ultrasonic testing and nano-indentation.
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Mechanical degradation of microelectronics solder joints under current stressing

TL;DR: In this paper, the experiment results for flip chip solder joints under high current stressing are reported, and they show the existence of a significant thermal gradient in solder joint during current stressing.
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Mechanics of Pb40/Sn60 near-eutectic solder alloys subjected to vibrations

TL;DR: In this paper, a material nonlinear time domain dynamic analysis of a solder joint was performed using a damage mechanics based constitutive model for isothermal condition and no thermal loads were considered.
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Size effects in small scaled lead-free solder joints

TL;DR: In this article, the authors used scanning electron microscopy (SEM) to analyze the complex modes of fracture and crack propagation in the solder interconnect and found that the variation of the gap size influenced also the crack growth behavior.
References
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Proceedings ArticleDOI

Energy-based methodology for the fatigue-life prediction of solder materials

TL;DR: In this paper, an energy-based damage criterion, which has not been used previously in solder fatigue-life assessment, was found to be superior to a plastic strain criterion in predicting the fatigue life of different solders.
Journal ArticleDOI

Creep-fatigue interactions in solders

TL;DR: In this article, the effects of frequency, stress range, mean stress, waveform (hold times on and off load), and mechanical history are investigated in bulk uniaxial solder in the ascast condition.
Journal ArticleDOI

Plastic flow study using the microgrid technique

TL;DR: In this paper, the process of plastic deformation development, the rate of grain boundary sliding and the distribution of intergranular and intragranular strain heterogeneities were studied by measurements of the x, y and z components of displacements (the x and y components by offsets and the z component by a stereophotometric method).
Journal ArticleDOI

Cyclic deformation and fracture in Pb-Sn solid solution alloy

TL;DR: In this paper, the cyclic deformation behavior of Pb-2 pct Sn solid solution alloy has been investigated, showing that grain boundary migration and sliding occur in a systematic manner, giving rise to a series of migration markings on the surface of deformed specimens.
Journal ArticleDOI

Effect of strain rate on fatigue of low-tin lead-base solder

TL;DR: In this article, the effect of tensile hold time (low strain rate) in reducing the number of cycles to failure was found to be much greater than that of ramp time (higher strain rate), while increase up to 1 h time per cycle for no-hold tests did not lead to fatigue life saturation.
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