Journal ArticleDOI
Effects of substrate temperature on electrical and structural properties of copper thin films
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TLDR
Results from this experiment show that the increase in substrate temperature generally promotes the grain growth and film resistivity with elevated substrate temperature, and possible mechanisms of substrate-temperature-dependent microstructure formation of these Cu films are discussed.About:
This article is published in Microelectronics Journal.The article was published on 2006-09-01. It has received 28 citations till now. The article focuses on the topics: Grain growth & Atmospheric temperature range.read more
Citations
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Effect of Sputtering Power on the Nucleation and Growth of Cu Films Deposited by Magnetron Sputtering
TL;DR: In this paper, the effect of sputtering DC power on the electrical, structural properties, and the nucleation and growth of Cu films during the initial stage of magnetron sputtering was investigated.
Journal ArticleDOI
Flux-Selected Titanyl Phthalocyanine Monolayer Architecture on Ag (111)
TL;DR: In this paper, the adsorption and molecular architecture of titanyl phthalocyanine (TiOPc) monolayer films on Ag (111) have been studied with scanning tunneling microscopy.
Journal ArticleDOI
Low electrical resistivity in thin and ultrathin copper layers grown by high power impulse magnetron sputtering
TL;DR: In this article, the authors have successfully deposited Cu thin films from 20 to 800 nm exhibiting reduced electrical resistivity by using a high power impulse magnetron sputtering (HiPIMS) process.
Journal ArticleDOI
Effect of microstructural evolution on magnetic properties of Ni thin films
TL;DR: The magnetic properties of Ni thin films, in the range 20-500 nm, at the crystalline-nanocrystalline interface are reported in this article, where the effect of thickness, substrate and substrate temperature has been studied.
Journal ArticleDOI
Investigation into the influence of direct current (DC) power in the magnetron sputtering process on the copper crystallite size
Kah-Yoong Chan,Bee-San Teo +1 more
TL;DR: This paper discusses the influence of direct current (DC) power in the magnetron sputtering process on the crystallite size of the copper (Cu) thin films deposited on p-type silicon substrate at room temperature.
References
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Journal ArticleDOI
Mechanisms for microstructure evolution in electroplated copper thin films near room temperature
James Mckell Edwin Harper,C. Cabral,Panayotis C. Andricacos,Lynne Gignac,Ismail C. Noyan,Kenneth P. Rodbell,Chao-Kun Hu +6 more
TL;DR: In this paper, a model based on grain boundary energy in the fine-grained as-deposited films providing the underlying energy density which drives abnormal grain growth is presented.
Journal ArticleDOI
The effect of substrate temperature and biasing on the mechanical properties and structure of sputtered titanium nitride thin films
TL;DR: In this paper, the effects of substrate temperature (Ts) and substrate biasing (Vb) on the mechanical properties and the microstructure of the TiNx thin films were investigated using depth sensing nanoindentation tests.
Journal ArticleDOI
A quantitative model for the evolution from random orientation to a unique texture in PVD thin film growth
TL;DR: In this paper, the tendency for the smallest possible surface energy was considered as the driving force for the texture evolution, and simple expressions for crucial characteristics of texture evolution were obtained, as for instance for the typical time (or thickness) at which the system will switch from a random to a peaked distribution, and for the time dependence of the spread of the orientational distribution of the crystallites in the growing film.
Journal ArticleDOI
Influence of dc magnetron sputtering parameters on surface morphology of indium tin oxide thin films
TL;DR: In this article, the surface morphology of indium tin oxide (ITO) thin films was monitored using atomic force microscopy and scanning electron microscopy (SEM) techniques, and the change in surface morphology was discussed in terms of crystallographic orientation and grain size.
Journal ArticleDOI
TEM annealing study of normal grain growth in silver thin films
TL;DR: In this paper, normal grain growth in 80nm-thick sputter-deposited Ag films was studied via in situ heating stage transmission electron microscopy, and an activation energy for grain growth of 0.53 eV (53 kJ/mol) was found, which is close to surface diffusion.
Related Papers (5)
Thickness dependence of the structural and electrical properties of copper films deposited by dc magnetron sputtering technique
Atomic force microscopy (AFM) and X-ray diffraction (XRD) investigations of copper thin films prepared by dc magnetron sputtering technique
Kah-Yoong Chan,Bee-San Teo +1 more