Journal ArticleDOI
Enhanced Diffusion of Silver Atoms on the Surface of Nanoparticles at Low Temperatures
Reads0
Chats0
TLDR
In this article, the structure development of 35 nm silver nanoparticles during low temperature sintering was examined in situ as the ambient temperature increased from room temperature up to 450 °C using X-ray diffraction and electron microscopy techniques.Abstract:
Microstructure development of 35 nm silver nanoparticles during the low temperature sintering was examined in situ as the ambient temperature increased from room temperature up to 450 °C using X-ray diffraction and electron microscopy techniques. Measured particle size increased rapidly up to ∼90 nm in the temperature range between 130 and 250 °C, which is thought to be from the atomic diffusion on the surfaces of nanoparticles. On the other hand, further increase of the annealing temperature results in little or almost no change in the grain size. Therefore, the sintering effect due to the surface diffusion of silver atoms is active only on the surface of nanoparticles whose size is less than ∼90 nm, indicating enhanced atomic mobility of silver atoms on the surface of nanoparticles.read more
Citations
More filters
Journal ArticleDOI
Effects of polymer surface energy on morphology and properties of silver nanowire fabricated via nanoimprint and E-beam evaporation
Zhi-Jun Zhao,Soon Hyoung Hwang,Sohee Jeon,Joo-Yun Jung,Jihye Lee,Dae-Geun Choi,Jun-Hyuk Choi,Sang-Hu Park,Jun-Ho Jeong +8 more
TL;DR: In this article, the authors demonstrate that use of different nanoimprint resins as a polymer pattern has a significant effect on the morphology of silver (Ag) nanowires deposited via an E-beam evaporator.
Journal Article
Room Temperature Preparation of Conductive Silver Features Using Spin-Coating and Inkjet Printing
P Crawford,CH Eindhoven +1 more
TL;DR: The conductivity of the silver patterns was found to be 10% that of bulk silver as discussed by the authors, with a linear increase in resistance seen for increasing strain, and no significant change in resistance was seen after 12000 cyclic deformations.
Journal ArticleDOI
The thermal stability of magnetically exchange coupled MnBi/FeCo composites at electric motor working temperature
TL;DR: The thermal stability of the magnetically exchange coupled MnBi/FeCo composites was tested by annealing at electric motor working temperature of 200 °C for 20, 40 and 60 hours as discussed by the authors.
Journal ArticleDOI
In situ growth of Ag nanoparticles on pristine graphene and their applications in conductive ink
Qin-Qin Xu,Baoning Lu,Jian Yin +2 more
Proceedings ArticleDOI
Reliability of nano-silver soldering paste with high thermal conductivity
TL;DR: In this article, the authors compared the performance of nano-sintered silver soldering paste with AuSn bonder in terms of joining strength, thermal conduction, electric conductivity and long-term reliability under low temperature without pressure.
References
More filters
Journal ArticleDOI
Ink‐jet Printing and Microwave Sintering of Conductive Silver Tracks
TL;DR: In this article, the authors used a laser sintering method to sinter printed nanoparticle structures, where the laser follows the conductive tracks and sinters these selectively, without affecting the substrate.
Journal ArticleDOI
Inkjet printing of nanosized silver colloids
TL;DR: A water-based conducting ink, composed of well dispersed nano-silver particles, has been successfully inkjet printed using an ordinary commercial printer.
Journal ArticleDOI
Triggering the sintering of silver nanoparticles at room temperature.
TL;DR: It was discovered that silver nanoparticles behave as soft particles when they come into contact with oppositely charged polyelectrolytes and undergo a spontaneous coalescence process, even without heating, and using this finding in printing conductive patterns, enables achieving high conductivities even at room temperature.
Journal ArticleDOI
Electronics Without Lead
TL;DR: Li et al. as mentioned in this paper reviewed the lead-free alloys and electrically conductive adhesives and concluded that no one leadfree interconnect material can serve as a substitute for the conventional tin-lead solder in all devices.
Journal ArticleDOI
Thermal Behavior of Silver Nanoparticles for Low-Temperature Interconnect Applications
TL;DR: In this paper, the authors investigated the low-temperature sintering behavior of nano Ag nanoparticles and found that the particles exhibited an obvious sinting behavior at significantly lower temperatures than the Tm (960°C) of silver.