Journal ArticleDOI
Fracture anisotropy in silicon single crystal
TLDR
In this paper, the effect of crystallographic orientation on fracture toughness and the fracture path of silicon single crystal was investigated Vickers microhardness indentation was used to introduce cracks along various crystallographic orientations on the (110, (001), and (111) planes.Abstract:
In this study the effect of crystallographic orientation on fracture toughness and the fracture path of silicon single crystal was investigated Vickers microhardness indentation was used to introduce cracks along various crystallographic orientations on the (110), (001), and (111) planes The fracture toughness variation was found to follow the symmetry of the indentation axis with no distinct correlation with the elastic constants The observations made suggest that the inclination angle of cleavage planes relative to the indent plane affects the fracture path and toughness significantly Prestraining decreased the hardness and improved the toughness without a modification of fracture pathread more
Citations
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High-cycle fatigue of single-crystal silicon thin films
TL;DR: In this paper, 12 thin-film single crystal silicon specimens were tested to failure in a controlled air environment (30/spl +mn/0.1/spl deg/C, 50/spl plusmn/2% relative humidity). Damage accumulation and failure of the notched cantilever beams were monitored electrically during the fatigue life test.
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Multiparadigm modeling of dynamical crack propagation in silicon using a reactive force field
TL;DR: This work reports a study of dynamic cracking in a silicon single crystal in which the ReaxFF reactive force field is used for several thousand atoms near the crack tip, while more than 100,000 atoms are described with a nonreactive force field.
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Changes in surface layer of silicon wafers from diamond scratching
TL;DR: In this article, the authors investigated diamond scratching at a high speed comparable to that in a grinding process on an ultraprecision grinder and found that an amorphous layer is formed on top of the pristine Si-I phase before the onset of chip formation.
Journal ArticleDOI
Strength and sharp contact fracture of silicon
TL;DR: In this paper, the fracture strength of Si wafers, dice and MEMS elements was analyzed using controlled indentation flaws, including measurements of hardness, crack lengths, crack propagation under applied stress, and inert and reactive strengths.
Journal ArticleDOI
Microfluidics: an enabling screening technology for enhanced oil recovery (EOR)
TL;DR: Several areas of development are proposed where implementation of microfluidics may bring about deeper understanding and hence better control over the processes of oil recovery based on fluid propagation, droplet generation, wettability control.
References
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Journal ArticleDOI
Direct Measurements of the Surface Energies of Crystals
TL;DR: In this paper, the surface energies of several simple crystals have been measured at −196°C by means of quantitative cleavage experiments and the measured values of their respective surface energies (ergs/cm2) are: 340, 1200, 450, 280, 230, 1240, and 105.
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A fracture mechanics analysis of indentation-induced Palmqvist crack in ceramics
Journal ArticleDOI
Surface Energy of Germanium and Silicon
TL;DR: In this article, a direct measurement of specific surface energy of Ge and Si made by the cleavage technique was made by measuring the force just necessary to move a crack "in reversible fashion".
Journal ArticleDOI
The brittle-to-ductile transition in pre-cleaved silicon single crystals
TL;DR: In this article, a series of fracture experiments were carried out at various strain-rates on pre-cracked silicon single crystals between -196° and 1000°C and the surface energy for cleavage was determined from many tests to be 2500 erg/cm2.
Journal ArticleDOI
Anisotropy in the hardness of single crystals
TL;DR: In this article, an analysis of the Knoop indentation process is presented which establishes a clear relationship between the effective resolved shear stress (t 0 9), in the bulk of the crystal beneath the indenter, and the observed hardness.
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